Abstract: Devices, systems and/or methods for repairing soft tissue adjacent a repair site. In one embodiment, a repair device includes a plate member and an anchor. The plate member having a periphery, the plate member configured to be positioned along an outer surface of the soft tissue. The anchor includes a base and six legs extending from the base, the six legs extending from the base being moveable to a curled configuration such that the six legs wrap around separate portions of the periphery of the plate member with the soft tissue therebetween. In this manner, the repair device may be anchored to the soft tissue.

Abstract: Devices, systems and/or methods for repairing soft tissue adjacent a soft tissue repair site. In one embodiment, a repair device configured to couple to soft tissue is provided. The repair device includes a capture portion and an anchor portion. The capture portion configured to extend with radial portions. The anchor portion includes a base with multiple legs extending therefrom. The multiple legs are configured to move from a linear position to a formed position such that, in the formed position, the multiple legs couple to structure of the capture portion.

Abstract: An improved wafer scale integrated circuit is described which includes non-contact power and data transmission coupling. Wireless power and data coupling reduces the mechanical stresses and strains on the wafer, and makes better use of the wafer area. An additional benefit comes from allowing better heat transfer management. In one embodiment, power is provided by inductive coupling. Data flow into and out of the wafer is accomplished optically, using optical detectors to receive and light emitting diodes to transmit. Multiple devices are integrated onto the semiconductor wafer. Systems may be incorporated using the traditional die sites. Connections between systems are made in the space between die sites.

Abstract: The present invention provides an integrated circuit chip having one or more circuit elements that perform a desired circuit function with the circuit elements being encompassed by a molding compound that forms a package for the chip. The molding compound has a capacitance associated with it. The integrated circuit chip includes a second integrated circuit element within the molding compound in which the second integrated circuit element monitors the molding compound to detect a change in capacitance in the molding compound resulting from a removal of a portion or all of the molding compound. In response to a detection of a change in capacitance, the second integrated circuit element alters the desired circuit function provided by the other integrated circuit elements.

Abstract: A method and structure for sensing data such as temperature with respect to objects such as silicon wafers undergoing fabrication or other processes involve the use of a monitor element of material and configuration similar to that of the objects being processed. A structure such as a closed loop or segment of a spiral may be formed on the surface of the monitor element, and acts as a secondary coil when brought into operative relation with a transformer structure which includes a primary coil, a current source and a sensing device. The sensing device senses variations in the electrical characteristics in the primary coil, caused by the presence of the monitor element, and can thereby determine the temperature or other desired data relating to the monitor element, which is substantially the same as comparable data for the objects being processed.

Abstract: A method and structure for sensing data such as temperature with respect to objects such as silicon wafers undergoing fabrication or other processes involve the use of a monitor element of material and configuration similar to that of the objects being processed. A structure such as a closed loop or segment of a spiral may be formed on the surface of the monitor element, and acts as a secondary coil when brought into operative relation with a transformer structure which includes a primary coil, a current source and a sensing device. The sensing device senses variations in the electrical characteristics in the primary coil, caused by the presence of the monitor element, and can thereby determine the temperature or other desired data relating to the monitor element, which is substantially the same as comparable data for the objects being processed.

Abstract: A memory security device within a chip which employs a power source coupled to the memory. The power source produces a signal having a level sufficient to erase or destroy the memory when the chip is exposed to acid. The power source includes an electrolytic cell for producing a direct voltage output, and an electrolytic signal amplification circuit coupled between the electrolytic cell and the memory.

Abstract: A beamline for X-ray lithography receives a fan of synchrotron radiation with a first mirror which has a concave/concave (toroidal) shape. This mirror collects the fan of X-rays and partially collimates the beam horizontally. The beam is then intercepted by a second refocusing mirror which has a saddle toroidal shape with a major concave radius of curvature and a minor convex radius of curvature. The refocusing mirror acts to collimate the X-rays horizontally and to focus the X-rays vertically. A third flat mirror may be interposed in the beam reflected from the second mirror and can pivot to change the angle of incidence to cause the beam to scan across the image plane. The two toroidal mirrors preferably have approximately a 2 degree grazing angle of incidence of the beam. The two toroidal mirrors act together to provide a very uniform image with a uniform power distribution in the beam.