Abstract: A double sided edge clip terminal for forming soldered connections with opposed contact pads on the edge of a substrate includes a pair of solder contacts each having spaced metal arms and cold extruded solder masses in the interior of the contacts between the arms. Openings are formed in the contacts between the arms to prevent wicking of molten solder along the terminal and away from the contact pads. The terminals are manufactured by extruding the solder masses through the openings and into the space between the arms and beyond the arms, without solder waste.

Abstract: A solder terminal strip stamp formed from thin metal stock includes a carrier strip, a plurality of solder terminals extending to one side of the carrier strip and reverse bend the contact arms on the ends of the terminals away from the strip. A thin solder layer is integrally bonded to contact arm and is joined to solder reservoirs located on the sides of the arms.

Abstract: An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart around a central vertically oriented substrate support so that each assembly is perpendicular an edge of a substrate on the support. Lead strip feed assemblies located adjacent each mounting assemblies cuts lead strip segments and feeds the lead strip segments into the mounting assemblies. The four mounting assemblies simultaneously mount the lead strip segments on the substrate.

Abstract: A lead assembly and method for forming electrical connections between pads on an integrated circuit chip and pads on a circuit board includes small diameter wires adhesively bonded to a supporting tape. The wires may be inwardly fanned to form connections between relatively widely spaced circuit board pads and relatively closely spaced chip pads.

Abstract: A substrate breaker positively feeds substrate plates to a stick breaker where the sticks are broken from the plate. The sticks are fed upwardly to an elevated chip breaker where chips are broken from the sticks.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered electrical connections with substrate pads. One end of the clip extends away from the substrate for making an electrical connection with a circuit component.

Abstract: A solder terminal includes a clip adapted to be positioned on one edge of a substrate for forming soldered connections with substrate pads. A leg extends from the clip for forming an electrical connection with a circuit component.

Abstract: A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to the lead frame adjacent recesses in the frame to permit bending of the rows of leads substantially along the axis of the supporting strip and thereby extend the heads of the leads upwardly to cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are spaced a distance less than the width of the device to be supported thereon prior to the rows of leads being reversely bent to restore the bent leads and heads thereon to the plane of the frame and ther

Abstract: A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of said leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to spaced locations on the lead frame and when the ends of the leads extending from one side of the strip are depressed from the plane of the frame, the ends of the strip where connected to the frame are twisted to extend the headed ends of the leads upwardly and thereby cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are closer together than the width of the device and receive the same for support thereon prior to the rows of leads being resto

Abstract: A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to the lead frame adjacent recesses in the frame to permit bending of the rows of leads substantially along the axis of the supporting strip and thereby extend the heads of the leads upwardly to cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are spaced a distance less than the width of the device to be supported thereon prior to the rows of leads being reversely bent to restore the bent leads and heads thereon to the plane of the frame and ther

Abstract: A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of said leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to spaced locations on the lead frame and when the ends of the leads extending from one side of the strip are depressed from the plane of the frame, the ends of the strip where connected to the frame are twisted to extend the headed ends of the leads upwardly and thereby cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are closer together than the width of the device and receive the same for support thereon prior to the rows of leads being resto

Abstract: A method and mechanism to form minute drops of solder paste of uniform size spaced in desired patterns upon substrates of semi-conductor devices by extruding the paste under pressure through similar holes in a die while closely spaced above a substrate and, immediately after contacting the ends of minute columns of the paste with the substrate to adhere the same thereto, instantly raising the die to effect separation of the columns from the adhered ends on the substrates which comprise dots of paste of substantially uniform size which are spaced from each other. The paste is dispensed from a shallow reservoir above the die and defined by a flexible diaphragm positioned in opposition to the die and against which a pressure member operates against the diaphragm and paste contained in the reservoir to effect discharge of the paste under pressure as described above.