Patents by Inventor Richard K. Etchells

Richard K. Etchells has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for predicting the time to failure of electronic devices at high temperatures
    Patent number: 6993446
    Abstract: A method and apparatus are disclosed for determining a time to failure for an electronic device. The method and apparatus includes estimating a dependency of a bond strength degradation rate on at least one parameter and estimating a temperature profile of the electronic device. Furthermore, the method and apparatus determine a bond strength based on the dependency of the bond strength degradation rate and the temperature profile, and determine the time to failure for the electronic device based on a time evolution of the bond strength.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: January 31, 2006
    Assignee: Schlumberger Technology Corporation
    Inventors: Ruvinda Gunawardana, Richard K. Etchells
  • METHOD AND APPARATUS FOR PREDICTING THE TIME TO FAILURE OF ELECTRONIC DEVICES AT HIGH TEMPERATURES
    Publication number: 20040182573
    Abstract: A method and apparatus are disclosed for determining a time to failure for an electronic device. The method and apparatus includes estimating a dependency of a bond strength degradation rate on at least one parameter and estimating a temperature profile of the electronic device. Furthermore, the method and apparatus determine a bond strength based on the dependency of the bond strength degradation rate and the temperature profile, and determine the time to failure for the electronic device based on a time evolution of the bond strength.
    Type: Application
    Filed: March 17, 2003
    Publication date: September 23, 2004
    Inventors: Ruvinda Gunawardana, Richard K. Etchells
  • Lead-free printed circuit assembly
    Patent number: 5536908
    Abstract: A printed circuit is provided that is capable of operating at temperatures above 200.degree. C. A printed wiring board has a plating scheme of Tin plating over sulfamate nickel plated over copper. The materials are electroplated in the pattern of the desired circuit. The copper provides a conductive material for carrying electrical current. The sulfamate nickel is a ductile material that serves as a barrier between the copper and the Tin and is able to maintain its strength under temperatures of above 200.degree. C. The Tin is compatible with the new solder compound that is used to solder electrical components to the board. The solder compound is comprised of Tin and Silver. This solder has a higher initial melting point than traditional Tin/Lead solders but has a lower solder reflow temperature than conventional HMP solder compounds. This new solder is also stronger than conventional HMP solder and contains virtually no Lead component.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: July 16, 1996
    Assignee: Schlumberger Technology Corporation
    Inventors: Richard K. Etchells, Lawrence E. Tawyea