Abstract: Disclosed in the present specification is a circuit board. The circuit board includes a first reference plane and a second reference plane, wherein the second reference plane includes a defected ground structure. The circuit board also includes a signal trace coupled to a signal via, wherein the signal trace is disposed above the first reference plane. The circuit board additionally includes a spiral inductor positioned adjacent to the defected ground structure, wherein the spiral inductor is coupled to the signal via.

Abstract: A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating portion has a longitudinal section and a plurality of alternating stubs extending from lateral surfaces of the longitudinal section.

Abstract: A signal line design is described herein. A circuit board may include a first signal line and a second signal line. The first signal line includes a pair of signal lines at a first depth of a section of a circuit board, wherein a centerline extends lengthwise between the pair of signal lines. The second signal line is disposed at a second depth of the circuit board. The second signal line includes a first segment that runs parallel to the first signal line at a first displacement from the center line. The second signal line includes a second segment that runs parallel to the first signal line on the other side of the center line at a second displacement distance from the center line.

Abstract: Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained.

Abstract: A signal line design is described herein. A circuit board may include a first signal line and a second signal line. The first signal line includes a pair of signal lines at a first depth of a section of a circuit board, wherein a centerline extends lengthwise between the pair of signal lines. The second signal line is disposed at a second depth of the circuit board. The second signal line includes a first segment that runs parallel to the first signal line at a first displacement from the center line. The second signal line includes a second segment that runs parallel to the first signal line on the other side of the center line at a second displacement distance from the center line.

Abstract: Disclosed in the present specification is a circuit board. The circuit board includes a first reference plane and a second reference plane, wherein the second reference plane includes a defected ground structure. The circuit board also includes a signal trace coupled to a signal via, wherein the signal trace is disposed above the first reference plane. The circuit board additionally includes a spiral inductor positioned adjacent to the defected ground structure, wherein the spiral inductor is coupled to the signal via.

Abstract: The present disclosure provides techniques for decreasing vertical crosstalk in a stripline. An apparatus may include a conductor bracketed by ground layers. The conductor may have a horizontal crosstalk. A vertical component may be coupled to the conductor. The vertical component may have a vertical crosstalk cancelled by the horizontal crosstalk.

Abstract: A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating portion has a longitudinal section and a plurality of alternating stubs extending from lateral surfaces of the longitudinal section.

Abstract: An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board.

Abstract: An electronic device may be formed of a printed circuit board having integrated circuits mounted thereon. A backing plate may compress an insulating layer against a microstrip line formed on one surface of said circuit board opposite to the surface that includes integrated circuits. By compressing said backing plate against said insulating layer, less crosstalk may result from the formation of a microstrip on the bottom surface of the printed circuit board. The backing plate may also be used to secure a cooling device, such as a heat sink, on the opposite side of the circuit board.

Abstract: A canted coiled spring is used as a highly conductive, high current electrode between a printed circuit board and a conductive strip connected to a selected voltage. A conductive channel member has fixed therein a coil spring made of a highly conductive, metallic material. The canted coiled spring is fixed at each end so that it may be easily slid along an adjacent electrode of the power strip. The channel member holding the canted coiled spring is coupled to a printed circuit board with a clamped, highly conductive contact surface. The use of the coil spring in a channel member connected to a printed circuit board permits the printed circuit board to be easily slid into, and out of electrical contact with power carrying electrodes.