Patents by Inventor Richard K. Tung

Richard K. Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Same-side gated process for encapsulating semiconductor devices
    Patent number: 5254501
    Abstract: A transfer molding process for encapsulating a semiconductor device, such as an integrated circuit, in plastic. The semiconductor device is mounted on and electrically connected to a leadframe, the leadframe is placed in a preheated mold with the device and electrical connections disposed in a cavity and preheated thermosetting plastic molding compound is injected into the cavity through a gate located on the same side of the mold cavity as the device and electrical connections.
    Type: Grant
    Filed: September 11, 1992
    Date of Patent: October 19, 1993
    Assignee: Cypress Semiconductor Corporation
    Inventors: Richard K. Tung, Joel J. Camarda