Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.

Abstract: An integrated circuit includes a first device having a first source or drain region, and a second device having a second source or drain region that is laterally adjacent to the first source or drain region. A conductive source or drain contact includes (i) a lower portion in contact with the first source or drain region, and extending above the first source or drain region, and (ii) an upper portion extending laterally from above the lower portion to above the second source or drain region. A dielectric material is between at least a section of the upper portion of the conductive source or drain contact and the second source or drain region. In an example, each of the first and second devices is a gate-all-around (GAA) device having one or more nanoribbons, nanowires, or nanosheets as channel regions, or is a finFet structure having a fin-based channel region.

Abstract: A perfusion catheter is used to avoid ischemia in case of failure of a conventional balloon angioplasty procedure on a stenotic blood vessel and a resulting partial or complete occlusion of the vessel. The balloon catheter is first removed from the vessel while the guide wire and the guide catheter are left in place. The perfusion catheter is immediately inserted into the guide catheter and run past the stenosis using the guide wire already in place. Blood is drawn from a side port in the sheath introduced at the point of entry into the vascular system of the patient under normal arterial pressure or after passing through an exterior pump for pressurization and re-injection in the perfusion catheter. Thus, blood flow to the part of the vessel past the occlusion can be reestablished within minutes of angioplasty failure and the patient can be stabilized in preparation for heart surgery.

Abstract: A perfusion catheter is used to avoid ischemia in case of failure of a conventional balloon angioplasty procedure on a stenotic blood vessel and a resulting partial or complete occlusion of the vessel. The balloon catheter is first removed from the vessel while the guide wire and the guide catheter are left in place. The perfusion catheter is immediately inserted into the guide catheter and run past the stenosis using the guide wire already in place. Blood is drawn from a side port in the sheath introduced at the point of entry into the vascular system of the patient under normal arterial pressure or after passing through an exterior pump for pressurization and re-injection in the perfusion catheter. Thus, blood flow to the part of the vessel past the occlusion can be reestablished within minutes of angioplasty failure and the patient can be stabilized in preparation for heart surgery.