Patents by Inventor Richard Kapp

Richard Kapp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility
    Patent number: 5083193
    Abstract: To further reduce the manufacturing costs of semiconductor devices, such as TO-92 transistors or thyristors, a prefabricated plastic can or housing is filled with cast resin, and the chip, together with its leads and a synthetic-resin cover, is inserted into the cast resin and the can, with portions of the leads engaging a groove in the can. The apparatus for inserting the chips, etc., into the cans includes a feed rail for the cans, a centering slide, and a swivelling gripper onto which the cans are pushed by the centering slide. When rotated, the swivelling gripper slips the cans over the chips mounted on a lead frame moving above the swivelling gripper.
    Type: Grant
    Filed: August 4, 1989
    Date of Patent: January 21, 1992
    Assignee: Deutsche ITT Industries GmbH
    Inventors: Viktor Heitzler, Richard Kapp