Patents by Inventor Richard Kay Dennis

Richard Kay Dennis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector block
    Patent number: 3993384
    Abstract: A connector block for forming interconnections between contact pads on a flat leadless IC package and corresponding pads on a parallel circuit board. The block carries a number of terminals each having a collapsible linkage such that when the package is moved toward the circuit board, collapse of the linkage is controlled by a guide surface and wiped pressure connections are formed between the terminals and pads on both the substrate and the circuit board.
    Type: Grant
    Filed: May 12, 1975
    Date of Patent: November 23, 1976
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Richard Kay Dennis, Edward Leal Hadden
  • Leadless package retaining frame
    Patent number: 3982159
    Abstract: A retaining frame for forming interconnections between contact pads on a flat leadless I.C. package and corresponding pads on a parallel mother board so that when the package is moved toward the mother board and into the frame, contacts in the frame are compressed and contact surfaces are biased toward and moved along the contact pads on the package and board to form positive wiped electrical connections.
    Type: Grant
    Filed: November 11, 1974
    Date of Patent: September 21, 1976
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Richard Kay Dennis, Edward Leal Hadden