Abstract: A method, system, and circuit for providing a bandgap voltage reference are provided. In an example, the method includes producing a first bandgap curve based at least in part on a first circuit, a second circuit, an operational amplifier, and one or more feedback resistors, where the first circuit corresponds to a first voltage that is complementary to absolute temperature (CTAT) and the second circuit corresponds to a second voltage that is proportional to absolute temperature (PTAT). The method also includes providing a temperature independent compensation to the first bandgap curve based at least in part on a bandgap device, a biasing circuit, and a resistor; providing a non-temperature compensation to the first bandgap curve based at least in part on an adjustable divider circuit; and generating a resulting bandgap curve from the first bandgap curve.

Abstract: Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Various embodiments of systems for transmitting and receiving digital and analog signals across a single isolator, solid state lighting systems, and DC/DC converter feedback regulation control systems are disclosed. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: Various embodiments of systems for transmitting and receiving digital and analog signals across a single isolator, solid state lighting systems, and DC/DC converter feedback regulation control systems are disclosed. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Abstract: According to one embodiment, there is provided a high voltage drive circuit comprising drive and sense electrodes formed substantially in a single plane. The device effects signal transfer between drive and receive circuits through the drive and sense electrodes by capacitive means, and permits high voltage devices, such as IGBTs, to be driven thereby without the use of high voltage transistors, thereby eliminating the need to use expensive fabrication processes such as SOI when manufacturing high voltage gate drive circuits and ICs. The device may be formed in a small package using, by way of example, using CMOS or other conventional low-cost semiconductor fabrication and packaging processes.

Abstract: A light sensor having a photocurrent subsection and an interface circuit is disclosed. The photocurrent subsection includes a photodetector, an amplifier, a diode and an impedance element. The first photodetector generates a current between a first node and a power rail in response to being illuminated with light. The interface circuit generates an output signal that is related to the logarithm of the intensity of light that is incident on the photodetector. The impedance element is constructed in a manner that compensates for the thermal dependency of the impedance through the diode. Additional photocurrent subsections can be added to further reduce the thermal dependency of the output signal.

Abstract: According to one embodiment, there is provided a high voltage drive circuit comprising drive and sense electrodes formed substantially in a single plane. The device effects signal transfer between drive and receive circuits through the drive and sense electrodes by capacitive means, and permits high voltage devices, such as IGBTs, to be driven thereby without the use of high voltage transistors, thereby eliminating the need to use expensive fabrication processes such as SOI when manufacturing high voltage gate drive circuits and ICs. The device may be formed in a small package using, by way of example, using CMOS or other conventional low-cost semiconductor fabrication and packaging processes.

Abstract: A light sensor having a photocurrent subsection and an interface circuit is disclosed. The photocurrent subsection includes a photodetector, an amplifier, a diode and an impedance element. The first photodetector generates a current between a first node and a power rail in response to being illuminated with light. The interface circuit generates an output signal that is related to the logarithm of the intensity of light that is incident on the photodetector. The impedance element is constructed in a manner that compensates for the thermal dependency of the impedance through the diode. Additional photocurrent subsections can be added to further reduce the thermal dependency of the output signal.

Abstract: An operational amplifier is described. The operational amplifier includes a first stage, a second stage, a third stage, and a fourth stage. The amplifier includes a nested transconductance-capacitance compensation configuration. The third stage includes class AB control mechanism. The fourth stage includes a class AB output stage.

Abstract: The transimpedance amplifier that performs signal amplification includes a first input that receives an input signal, a second input that receives a power signal, a third input that receives a control signal, and an output that generates an output signal. The transimpedance amplifier includes at least one signal amplification circuit that receives the power signal, input signal, and the control signal and that performs both signal amplification on the input signal and regulation of the power signal in response to the control signal.