Patents by Inventor Richard Kulkaski

Richard Kulkaski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6244641
    Abstract: A wafer transfer arm made from a machineable material for picking up and delivering a semiconductor wafer from one location to another, includes a blade body with a longitudinal channel extending along one surface, and a coverplate adapted to matingly fit into the channel for defining a vacuum conduit therein. The vacuum conduit provides fluid communication between an inlet at one end of the blade body and an outlet at the other end, for suctionally retaining the semiconductor wafer by vacuum pressure or suction.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: June 12, 2001
    Assignee: M.E.C. Technology, Inc.
    Inventors: Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
  • Patent number: 6237528
    Abstract: A plasma reactor showerhead electrode assembly for processing semiconductor wafers comprised of a typically silicon disk shaped gas plate having a plurality of gas passage holes formed therethrough by a ultrahigh velocity water jet boring apparatus, and a graphite circular split collar assembly including first and second semicircular sections forming a circumferential inner slot when opposing ends of said sections are secured together, the slot mating in a dovetail connection with an outer circumferential groove of said gas plate for retaining the latter between said sections. A conductive gasket may be interposed between the gas plate groove and the mating collar assembly to provide an electrically and thermally conductive seal. The first and second semicircular sections have opposing ends screwed or pinned together for providing easy disassembly thereof for replacement of the gas plate.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: May 29, 2001
    Assignee: M.E.C. Technology, Inc.
    Inventors: Matthew P. Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
  • Patent number: 6170432
    Abstract: A showerhead electrode assembly for a plasma reactor for processing semiconductor wafers includes a gas plate having a plurality of through holes for passage of gas. The top face or side of the gas plate is of smaller diameter than the bottom side or face of the gas plate. An acutely angled peripheral groove is formed between the top face of the gas plate, and the lower portion thereof, with the groove terminating at a band-like ledge with the top face and lower portion. A locking ring is provided by two identical semicircular sections, each of which include in a lower portion of an inside sidewall, respectively, an acutely angled peripheral groove for mating with the groove of the gas plate. A unitary circular support collar is formed with a circular channel in a bottom portion thereof.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: January 9, 2001
    Assignee: M.E.C. Technology, Inc.
    Inventors: Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli
  • Patent number: 6050216
    Abstract: A plasma reactor showerhead electrode assembly for processing semiconductor wafers comprised of a typically silicon disk shaped gas plate having a plurality of gas passage holes therethrough, and a graphite circular split collar assembly including first and second semicircular sections forming a circumferential inner slot when opposing ends of said sections are secured together, the slot mating in a dovetail connection with an outer circumferential groove of said gas plate for retaining the latter between said sections. A conductive gasket may be interposed between the gas plate groove and the mating collar assembly to provide an electrically and thermally conductive seal. The first and second semicircular sections have opposing ends screwed or pinned together for providing easy disassembly thereof for replacement of the gas plate.
    Type: Grant
    Filed: August 21, 1998
    Date of Patent: April 18, 2000
    Assignee: M.E.C. Technology, Inc.
    Inventors: Matthew Peter Szapucki, Richard Kulkaski, Trevor J. Hadley, Mark Anthony Santorelli, Robert H. Stoever
  • Patent number: 5671958
    Abstract: A latch mechanism is described having a housing comprised of a top plate having an aperture, side walls and an end wall depending from the top plate so as to leave a ledge adjacent its periphery, resilient tabs extending outwardly from said side walls and toward said top plate, slots in the side walls parallel to the top plate, a bolt suspended in said housing by wings extending into respective slots and a spring between the end wall of said housing and an end of the bolt.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: September 30, 1997
    Inventors: Matthew Peter Szapucki, Richard Kulkaski
  • Patent number: 5657975
    Abstract: A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion molded into the electrically non-conductive material of the clip head behind a front face thereof, whereby the spring and clip head form a monolithic assembly.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: August 19, 1997
    Inventors: Matthew Peter Szapucki, Richard Kulkaski
  • Patent number: 5458322
    Abstract: A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion affixed to a front face of the clip head via an electrically nonconductive rectangularly shaped retainer for substantially reducing voltage arcing between the highly electrically charged plasma used in processing a semiconductor wafer and the clip head.
    Type: Grant
    Filed: March 25, 1994
    Date of Patent: October 17, 1995
    Inventors: Richard Kulkaski, Matthew P. Szapucki
  • Patent number: 4951869
    Abstract: The invention relates to a telephone coin collection box, to be closed with a cover, for a telephone system. The bottom and the sides of the coin box are made of plastic. A stainless steel staple is attached to the front side for lockingly engaging a cover and triple hinge openings are disposed in the rear side near the straight upper edge. The coin box according to the invention provides high stability against damage during handling and can be manufactured in an inexpensive way. Following drop tests performed on coin boxes, the plastic coin box exhibited a remarkable toughness and showed no distortions and could still fit into the respective compartment of a coin-operated telephone.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: August 28, 1990
    Inventors: Mathew Szapucki, Richard Kulkaski
  • Patent number: RE37916
    Abstract: A latch mechanism is described having a housing comprised of a top plate having an aperture, side walls and an end wall depending from the top plate so as to leave a ledge adjacent its periphery, resilient tabs extending outwardly from said side walls and toward said top plate, slots in the side walls parallel to the top plate, a bolt suspended in said housing by wings extending into respective slots and a spring between the end wall of said housing and an end of the bolt.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: December 3, 2002
    Assignee: Ashland Products, Inc.
    Inventors: Matthew Peter Szapucki, Richard Kulkaski