Abstract: A door assembly includes a door body, an upper panel slidably mounted on the door body, a lower panel slidably mounted on the door body and an interconnection between the upper and lower panels so that the upper panel may be raised with the lower panel. Preferably, a pair of retractable screens is mounted on the door body and connected respectively to the upper and lower panels.

Abstract: A door assembly includes a door body; a first panel slidably mounted on the door body; a second panel slidably mounted on the door body; a first retractable screen mounted on the door body and connected to the first panel; and a second retractable screen mounted on the door body and connected to the second panel. The panels typically includes window panes and are openable to create a pair of spaced openings through the door which are covered by the retractable screens.

Abstract: A door assembly includes a door body; a panel, typically a window, which is slidably mounted on the door body; a retractable screen mounted on the door; and a removable connection between the screen and the panel. Preferably, the connection is a peelably removable connection. The connection may include a self-mating reclosable fastener, a hook and loop fastener or the like. The connection may include one or more magnets, preferably in the form of flexible magnetic strips. The door assembly thus simplifies the installation of the screen and its removal and replacement.

Abstract: A multiple chip interconnection system and package for interconnecting and cooling integrated circuits includes an electrically-conductive plate 10 having an upper surface 12. On the upper surface 12, a first layer of polyimide 16 or other electrically-insulating material is deposited. One or more layers of electrical interconnections 17, 18, 21, 22, and insulating material 19, 24, are then disposed on the insulating material 16 to provide a network of electrical connections embedded in insulating material, yet which is sufficiently thin to offer minimal thermal resistance to the transfer of heat from integrated circuits mounted thereon to the plate 10. After the layers of interconnections are completed, one or more conductive planes are deposited across the interconnections to serve as a mounting surface for the integrated circuits and to distribute power and ground signals as necessary.

Abstract: A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.

Abstract: A module for a semiconductor chip having a front face with a two dimensional array of power, ground and signal contacts is disclosed. Power, ground and signal conductors extend from the respective contacts on the front face of the chip. A pair of electrically conductive plates are parallel to the front face of the chip and located at the termination of the conductors. The plate nearer the conductors is electrically coupled to either the power or ground conductors, and contains apertures corresponding to the remaining ground or power conductors and to the signal conductors. A plurality of discrete signal transmission members are located at a surface of the plate farther from the conductors. The ground or power conductors not connected to the near plate are electrically coupled to the far plate through certain of the apertures, and the signal conductors are coupled to the respective signal transmission members through the remaining apertures.