Patents by Inventor Richard L. C. Wu

Richard L. C. Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices having a diamond-like-carbon dielectric
    Patent number: 8760844
    Abstract: A structural capacitor includes a first carbon fiber material layer, a second carbon fiber material layer, and an interlayer dielectric including a diamond-like-carbon material layer.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: June 24, 2014
    Assignee: Mesoscribe Technologies, Inc.
    Inventors: William G. Baron, Jeffrey A. Brogan, Sandra Fries-Carr, Richard J. Gambino, Christopher Gouldstone, Brian Keyes, Sanjay Sampath, Huey-Daw Wu, Richard L. C. Wu
  • Dielectric coatings and use in capacitors
    Patent number: 8030219
    Abstract: A coated substrate product is described comprising a substrate and a dielectric coating material comprising carbon, hydrogen, silicon, and oxygen. According to the method, the substrate is processed by plasma cleaning the surface and then depositing a dielectric coating by a suitable plasma process. The coating may contain one or more layers. The substrate may be a rigid material or a thin film or foil. The coated products of this invention have superior dielectric material properties and utility as substrates for the manufacture of rolled or parallel plate capacitors with high energy densities.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: October 4, 2011
    Assignees: Morgan Advanced Ceramics, Inc., K Systems Corporation
    Inventors: Fred M. Kimock, Steven J. Finke, Richard L. C. Wu