Abstract: Semiconductor On Polymer (SOP) is a flexible ultra-thin substrate that can be used as the starting material for CMOS, MEMS or Complex Interconnects such as an interposer. The described process results in a flexible SOP device with open bond pads. After deposition of a liquid polymer onto a semiconductor substrate, the polymer is converted to a solid, creating a new substrate that is temporarily bonded to a carrier wafer. The semiconductor layer is then etched to be ultra-thin and highly uniform, specifically, a single crystalline silicon layer. Following fabrication of devices and interconnects on the polymer substrate, the ultra thin wafer is released from the carrier wafer in substrate form to be used whole or tiled for subsequent assembly. Among other advantages, the flexible format of the SOP substrate enables low resistance 3-D interconnects, and provides for a significant increase in performance due to a reduction in parasitic capacitance.

Abstract: A method for correcting predictable errors in the location of detected scintillation events acquired during emission computed tomography by a rotational scintillation gamma camera system. The method includes calibrating the rotational scintillation camera system and generating a look-up table comprising a set of pairs of x and y offset values, one pair for each viewing angle. The calibration reflects systemic deviations in the location of the rotating camera head detector measured in terms of x and y coordinates in the frame of reference of the detector for a plurality of view angles relative to the geometric ideal expected path. Once a look-up table is generated for a camera system, the detected location of each gamma event is altered in real time by adjusting in the camera head the x,y coordinate location of each event by the x,y offset values previously generated for the corresponding viewing angle associated with the detected event.