Abstract: The present apparatus provides for the automatic shaping and/or cutting of the leads of integrated circuit components which are intermittently advanced to and through a straightening and cutting portion of the apparatus. A base plate is disposed at an angle of approximately 40.degree. to the horizontal and provides a base for the gravitational feeding of integrated circuit components carried in plastic guides both before and after trimming. The untrimmed components are fed by gravity to a metering station whereat a rubber roller is intermittently rotated so that each component is brought in way of a pair of opposed processing blades. These blades are simultaneously advanced by eccentric means which are moved in strict timed relationship to the movement of the component in way of the processing blades. As cutoff blades they cooperate with a center guide die to provide the desired shearing action. Both blades and die may be sharpened several times without losing the desired registration.