Abstract: An electronic device (100) comprises a circuit carrying substrate (300) having an electronic circuit pattern (301) formed thereon, at least one component (302) having leads (304) for electrically coupling the at least one component (302) to the electronic circuit pattern (301) formed on the circuit carrying substrate (300), and a thermoplastic coating (200, 200') for covering the leads (304) of the at least one component (302) to insulate the leads (304) thereof.

Abstract: According to the present invention, a screen printer (200) selectively applies solder paste to multiple types of printed circuit boards. The screen printer (200) includes mobile placement equipment (210), which receives and transports the boards, and application equipment, which includes first and second stencils (225), frames for holding the stencils (225) in fixed positions, and an applicator (415) for applying solder paste to a board through either the first or second stencil (225). A controller (215) determines the type of a board received by the mobile placement equipment (210), then, when the board is of a first type, directs the mobile placement equipment (210) to a location aligned with the first stencil. When the board is of a second type, the mobile placement equipment (210) is directed to a location aligned with the second stencil.

Abstract: A single screen printer (200) holds at least two solder stencils (225). The screen printer (200) receives a printed circuit board (105) and determines a printed circuit board configuration. When the printed circuit board (105) is of a first configuration, the printed circuit board (105) is aligned with a first stencil (225) and solder paste is selectively applied to the printed circuit board (105) through the first stencil (225). When the printed circuit board (105) is of a second configuration, the printed circuit board is aligned with a second stencil (225) through which solder paste is selectively applied to the printed circuit board (105).

Abstract: A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).