Abstract: A non-volatile memory device including at least a first electrode and a second electrode provided on a substrate, the first and second electrodes being separated from each other; an organic semiconductive polymer electrically connecting the first and second electrodes; an electrolyte in contact with the organic semiconductive polymer; and a third electrode that is not in contact with the first electrode, the second electrode, and the organic semiconductive polymer; wherein the organic semiconductive polymer has a first redox state in which it exhibits a first conductivity, and a second redox state in which it exhibits a second conductivity.

Abstract: Two- and three-terminal molecular electronic devices with ballistic electron transport are described. For example, a two-terminal molecular electronic device includes a conductor 1 layer/molecule 1 layer/conductor2 layer junction, wherein the total thickness of the molecule 1 layer and the conductor2 layer is less than or approximately equal to the mean free path of a charge carrier traveling in the two layers, and wherein ballistic transport can occur for some fraction of a plurality of charge carriers in the two layers.

Abstract: Metal contact formation for molecular device junctions by surface-diffusion-mediated deposition (SDMD) is described. In an example, a method of fabricating a molecular device junction by surface-diffusion-mediated deposition (SDMD) includes forming a molecular layer above a first region of a substrate. A region of metal atoms is formed above a second region of the substrate proximate to, but separate from, the first region of the substrate. A metal contact is then formed by migrating metal atoms from the region of metal atoms onto the molecular layer.

Abstract: Two- and three-terminal molecular electronic devices with ballistic electron transport are described. For example, a two-terminal molecular electronic device includes a conductor 1 layer/molecule 1 layer/conductor2 layer junction, wherein the total thickness of the molecule 1 layer and the conductor2 layer is less than or approximately equal to the mean free path of a charge carrier traveling in the two layers, and wherein ballistic transport can occur for some fraction of a plurality of charge carriers in the two layers.

Abstract: A non-volatile memory device including at least a first electrode and a second electrode provided on a substrate, the first and second electrodes being separated from each other; an organic semiconductive polymer electrically connecting the first and second electrodes; an electrolyte in contact with the organic semiconductive polymer; and a third electrode that is not in contact with the first electrode, the second electrode, and the organic semiconductive polymer; wherein the organic semiconductive polymer has a first redox state in which it exhibits a first conductivity, and a second redox state in which it exhibits a second conductivity.

Abstract: Metal contact formation for molecular device junctions by surface-diffusion-mediated deposition (SDMD) is described. In an example, a method of fabricating a molecular device junction by surface-diffusion-mediated deposition (SDMD) includes forming a molecular layer above a first region of a substrate. A region of metal atoms is formed above a second region of the substrate proximate to, but separate from, the first region of the substrate. A metal contact is then formed by migrating metal atoms from the region of metal atoms onto the molecular layer.

Abstract: The electronic properties of molecular junctions of the general type carbon/molecule/TiO2/Au as examples of “molecular heterojunctions” consisting of a molecular monolayer and a semiconducting oxide. Junctions containing fluorene bonded to pyrolyzed photoresist film (PPF) were compared to those containing Al2O3 instead of fluorene, and those with only the TiO2 layer. The responses to voltage sweep and pulse stimulation were strongly dependent on junction composition and temperature. A transient current response lasting a few milliseconds results from injection and trapping of electrons in the TiO2 layer, and occurred in all three junction types studied. Conduction in PPF/TiO2/Au junctions is consistent with space charge limited conduction at low voltage, then a sharp increase in current once the space charge fills all the traps. With fluorene present, there is a slower, persistent change in junction conductance which may be removed by a reverse polarity pulse.

Abstract: An electronic junction of the present invention comprises: (a) a first conductive component comprising: (i) a substrate having a contact surface; and (ii) at least one layer of molecular units having first and second ends, wherein at least one layer of molecular units is attached through their first ends to the contact surface through a type of association selected from the group consisting of: covalent bonding and strong electronic coupling; and (b) a second conductive component in electrical contact with the second ends of at least one layer of molecular units, the second conductive component comprising at least one metal and at least one metal oxide, wherein at least one conductive component in electronic junction has an electrical property that changes in response to a stimulus.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: a substrate having a contact surface, and a monolayer of a plurality of substantially parallel molecular units attached to the contact surface of the substrate. The molecular units are strongly coupled electronically to the substrate. The contact surface of the substrate has a roughness value less than or equal to the average length of the molecular units. The molecular units comprise a chemical structure that is capable of being changed from a relatively non-conductive state to a relatively conductive state by the application of a stimulus. The present invention also includes electronic circuit components and devices including chemical monolayer constructions.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.

Abstract: The present invention includes a chemical monolayer construction that comprises: a substrate having a contact surface, and a monolayer of a plurality of substantially parallel molecular units attached to the contact surface of the substrate. The molecular units are strongly coupled electronically to the substrate. The contact surface of the substrate has a roughness value less than or equal to the average length of the molecular units. The molecular units comprise a chemical structure that is capable of being changed from a relatively non-conductive state to a relatively conductive state by the application of a stimulus. The present invention also includes electronic circuit components and devices including chemical monolayer constructions.

Abstract: The present invention includes a chemical monolayer construction that comprises: (a) a substrate having a contact surface; and (b) a plurality of substantially parallel molecular units, wherein said molecular units are attached to said substrate so as to be strongly coupled electronically to said substrate, such as through a conjugated bond. The present invention also includes electronic circuit components and devices including a chemical monolayer construction of the present invention.