Patents by Inventor Richard L. Rassel

Richard L. Rassel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad for wafer and package for CMOS imager
    Patent number: 8232651
    Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: July 31, 2012
    Assignee: International Business Machines Corporation
    Inventors: James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel
  • BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
    Publication number: 20120098105
    Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.
    Type: Application
    Filed: January 4, 2012
    Publication date: April 26, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel
  • Bond pad for wafer and package for CMOS imager
    Patent number: 8119456
    Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seat between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 21, 2012
    Assignee: International Business Machines Corporation
    Inventors: James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel
  • BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
    Publication number: 20100038773
    Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seat between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.
    Type: Application
    Filed: October 20, 2009
    Publication date: February 18, 2010
    Applicant: International Business Machines Corporation
    Inventors: James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel