Patents by Inventor Richard L. Shook

Richard L. Shook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8013428
    Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: September 6, 2011
    Assignee: LSI Corporation
    Inventors: Kultaransingh N. Hooghan, John W. Osenbach, Brian Dale Potteiger, Poopa Ruengsinsub, Richard L. Shook, Prakash Suratkar, Brian T. Vaccaro
  • Publication number: 20090291321
    Abstract: A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.
    Type: Application
    Filed: July 28, 2009
    Publication date: November 26, 2009
    Applicant: LSI Corporation
    Inventors: Kultaransingh N. Hooghan, John W. Osenbach, Brian Dale Potteiger, Poopa Ruengsinsub, Richard L. Shook, Prakash Suratkar, Brian T. Vaccaro