Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. An insert is adhesively fastened to the bottom wall. The insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively fastening an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. The insert is a material selected from an epoxy molding compound and a ceramic material. An ejection head chip is adhesively fastened to the die bond surface of the insert.

Abstract: A fluid fillable cartridge, a method for preventing contamination of nozzle holes in a fluid ejector chip and a method for making an adhesive sealing tape. The fluid fillable cartridge has an open fluid reservoir therein and a fluid ejector chip attached to an exposed surface of the fluid fillable cartridge opposite to the open fluid reservoir. An adhesive sealing tape is attached to the fluid fillable cartridge, wherein the adhesive sealing tape has an adhesive pattern on a first end of the adhesive sealing tape that is configured to attach the adhesive sealing tape adjacent to the fluid ejector chip while being devoid of adhesive in nozzle hole areas of the fluid ejector chip.

Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.

Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.

Abstract: A fluidic dispensing device includes a housing having an exterior wall and a chamber. The exterior wall has a chip mounting surface defining a first plane and has an opening. The chamber has a port coupled in fluid communication with the opening. An ejection chip is mounted to the chip mounting surface and is oriented along the first plane, and is in fluid communication with the opening. The ejection chip has a fluid ejection direction that is substantially orthogonal to the first plane. A stir bar is located in the chamber, and has a rotational axis. The rotational axis of the stir bar is oriented in an angular range of perpendicular, plus or minus 45 degrees, relative to the fluid ejection direction.

Abstract: A method of controlling a height of an encapsulant material on an inkjet printhead is provided. The method includes dispensing the encapsulant material on an outer portion of the inkjet printhead. The encapsulant material is then depressed to reduce its height on the outer portion of the inkjet printhead. The encapsulant material may be depressed directly after dispensing or before it completely cures. The encapsulant material may be completely cured before reducing its height. The height of the cured encapsulant material may be reduced by removing a top portion of the encapsulant material through machining operation. Reducing the height of the encapsulant material on the inkjet printhead minimizes the distance of the nozzle plate of the inkjet printhead to the printing media, thus improving print quality.

Abstract: A method of controlling a height of an encapsulant material on an inkjet printhead is provided. The method includes dispensing the encapsulant material on an outer portion of the inkjet printhead. The encapsulant material is then depressed to reduce its height on the outer portion of the inkjet printhead. The encapsulant material may be depressed directly after dispensing or before it completely cures. The encapsulant material may be completely cured before reducing its height. The height of the cured encapsulant material may be reduced by removing a top portion of the encapsulant material through machining operation. Reducing the height of the encapsulant material on the inkjet printhead minimizes the distance of the nozzle plate of the inkjet printhead to the printing media, thus improving print quality.

Abstract: A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Abstract: Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.

Abstract: A method of micro-machining a semiconductor substrate to form through slots therein and substrates made by the method. The method includes providing a dry etching chamber having a platen for holding a semiconductor substrate. During an etching cycle of a dry etch process for the semiconductor substrate, a source power is decreased, a chamber pressure is decreased from a first pressure to a second pressure, and a platen power is increased from a first power to a second power. Through slots in the substrate provided by the method can have a reentrant profile for fluid flow therethrough.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Abstract: The present invention concerns a method and tools for forming sheet metal, and in particular, a method for making a chase top from a stock rectangular piece of sheet metal. Creasing tools are described that each have a handle member and a creasing wheel suspended therefrom cooperates with a support lip to form first and second crease lines and first and second flange areas along each perimeter edge of the workpiece. A reinforcing ridge tool is shown having a handle member with a wheel rotatively suspended therefrom is used to indent the sheet metal along desired lines inwardly of the crease lines to form reinforing ridges. A bending tool is described having cooperating bending members for clamping the workpiece along each second crease line for bending the workpiece there along to form vertical wall portions.

Abstract: The present invention concerns a method and tools for forming sheet metal, and in particular, a method for making a chase top from a stock rectangular piece of sheet metal. Creasing tools are described that each have a handle member and a creasing wheel suspended therefrom cooperates with a support lip to form first and second crease lines and first and second flange areas along each perimeter edge of the workpiece. A reinforcing ridge tool is shown having a handle member with a wheel rotatively suspended therefrom is used to indent the sheet metal along desired lines inwardly of the crease lines to form reinforcing ridges. A bending tool is described having cooperating bending members for clamping the workpiece along each second crease line for bending the workpiece there along to form vertical wall portions.