Abstract: The invention is an electroplating apparatus which partially submerges disks in the electrolytic solution, and provides electrical contact to the portions of the disk protruding above the solution. The disks are rotated during plating such that successive portions of the disk emerge from the solution, contact the electrical contact and then re-enter the solution. The disks are inserted into individual disk holders consisting of non-conductive shielding rings attached to a common bracket. The shielding rings are hinged such that the rings may be opened to insert the disks. When the disks are enclosed in the rings, they are supported by small non-conductive support wheels rotatably mounted in the rings. The rings remain stationary as the disks are rotated. To promote even plating, selectively-coated anode sheets are interleaved with the disk holding rings such that each holder has an anode sheet on either side.