Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract: A method of forming a composite part (10) having a skin (12) and at least one elongated stiffener (14) extending from the skin (12), the method comprising: providing a mold (20) having a mold surface (22, 26) and a respective elongated compaction cavity for each stiffener (14), each compaction cavity (24) opening into the mold surface (22, 26); for each stiffener (14): placing a bagged insert (30) including an insert (40) received in a tubular bag (42) in the respective compaction cavity (24), supporting the stiffener (14) with the bagged insert (30), the stiffener (14) having a first part extending in the compaction cavity (24) snuggly between a side surface of the bagged insert (30) and an adjacent side surface of the mold (20) bordering the compaction cavity (24), the stiffener (14) having a second part connected to the first part and extending over at least one of the mold surface (22, 26) and a top surface of the bagged insert (30); placing a skin (12) over and in contact with the mold surface (22, 26),

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

Abstract: One embodiment provides a method for identifying a probability that an object will fail, comprising: generating a plurality of force distributions for an object, wherein a force distribution simulates an amount of force on the object resulting from an activity with the object; compressing the plurality of force distributions into a set of conditions; performing an analysis on the set of conditions to determine a stress experienced by the object; and identifying a probability that the object will fail, wherein the identifying comprises determining whether the stress experienced by the object exceeds a yield stress of the object. Other aspects are described and claimed.

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract: A portable chamber for hyperbaric and/or hypoxic treatment comprises an open-ended and typically frustro-conical tubular body sized to accommodate at least one occupant, and two end members configured to be respectively received at opposite extremities of the body for closing the body in a seal tight arrangement. The body of the chamber is made of a flexible yet reinforced elastomeric material such as to be collapsible during transport. One of the end members is provided with a door to provide access to the interior of the chamber. The extremities of the body are substantially spherical such as to receive the correspondingly substantially periphery of the end members. When the chamber is supplied with gases during hyperbaric or hypoxic treatment, the spherical peripheries of the end members are urged against the spherical extremities of the body, thereby providing a seal tight chamber. A treatment system comprising the chamber is also disclosed.

Abstract: A flip chip assembly is disclosed that includes a die with die circuitry and a plurality of electrical contacts electrically connected to the die circuitry. A substrate includes electrical contacts that are juxtaposed with and electrically connected to corresponding die electrical contacts. A passive component is disposed between the die and the substrate, and includes a dielectric disposed between a first electrode and a second electrode. The first electrode is electrically connected to a first of the die electrical contacts and a corresponding substrate electrical contact, and the second electrode is electrically connected to a second of the die electrical contacts and a corresponding substrate electrical contact.

Abstract: A portable chamber for hyperbaric and/or hypoxic treatment comprises an open-ended and typically frustro-conical tubular body sized to accommodate at least one occupant, and two end members configured to be respectively received at opposite extremities of the body for closing the body in a seal tight arrangement. The body of the chamber is made of a flexible yet reinforced elastomeric material such as to be collapsible during transport. One of the end members is provided with a door to provide access to the interior of the chamber. The extremities of the body are substantially spherical such as to receive the correspondingly substantially periphery of the end members. When the chamber is supplied with gases during hyperbaric or hypoxic treatment, the spherical peripheries of the end members are urged against the spherical extremities of the body, thereby providing a seal tight chamber. A treatment system comprising the chamber is also disclosed.

Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

Abstract: Disclosed herein are two methods for rapid multiplex analysis to determine the presence and identity of target DNA sequences within a DNA sample. Both methods use reporting DNA sequences, e.g., modified conventional Taqman® probes, to combine multiplex PCR amplification with microsphere-based hybridization using flow cytometry means of detection. Real-time PCR detection can also be incorporated. The first method uses a cyanine dye, such as, Cy3™, as the reporter linked to the 5? end of a reporting DNA sequence. The second method positions a reporter dye, e.g., FAM, on the 3? end of the reporting DNA sequence and a quencher dye, e.g., TAMRA, on the 5? end.

Abstract: Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.

Abstract: A nucleic acid assay system for analyzing a sample using a reagent. A sample and reagent delivery unit is operatively connected to a thermal cycler for delivering the sample and the reagent to the thermal cycler. A hybridization chamber is operatively connected to the thermal cycler. A flow cytometer is operatively connected to the hybridization chamber.

Abstract: Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.

Abstract: A simplified two-piece airfairing which is nestable when not in the operative position, as for example during shipping. To change from the nested to the operative position only requires manipulation of a few nuts and bolts and rotation of the top part.