Patents by Inventor Richard Larder
Richard Larder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7841863Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: GrantFiled: June 30, 2009Date of Patent: November 30, 2010Assignee: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder
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Patent number: 7825674Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: GrantFiled: June 30, 2006Date of Patent: November 2, 2010Assignee: FormFactor, Inc.Inventors: Makarand S. Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy, Benjamin N. Eldridge
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Patent number: 7642794Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: December 21, 2007Date of Patent: January 5, 2010Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand S. Shinde, Gaetan L. Mathieu
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Publication number: 20090263986Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: ApplicationFiled: June 30, 2009Publication date: October 22, 2009Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder
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Patent number: 7560941Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: October 10, 2006Date of Patent: July 14, 2009Assignee: FormFactor, Inc.Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand S. Shinde, Gaetan L. Mathieu
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Patent number: 7553165Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: GrantFiled: May 13, 2008Date of Patent: June 30, 2009Assignee: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder
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Publication number: 20080254651Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: ApplicationFiled: May 13, 2008Publication date: October 16, 2008Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder
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Patent number: 7371072Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: GrantFiled: December 29, 2003Date of Patent: May 13, 2008Assignee: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder
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Publication number: 20080094088Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: December 21, 2007Publication date: April 24, 2008Inventors: Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Patent number: 7312618Abstract: A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: July 3, 2006Date of Patent: December 25, 2007Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand S. Shinde, Gaetan L. Mathieu
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Publication number: 20070139060Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: October 10, 2006Publication date: June 21, 2007Inventors: Rod Martens, Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Publication number: 20060244470Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: ApplicationFiled: June 30, 2006Publication date: November 2, 2006Inventors: Makarand Shinde, Richard Larder, Timothy Cooper, Ravindra Shenoy, Benjamin Eldridge
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Publication number: 20060238211Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: July 3, 2006Publication date: October 26, 2006Inventors: Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Patent number: 7119564Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: August 30, 2005Date of Patent: October 10, 2006Assignee: FormFactor, Inc.Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Patent number: 7071715Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: GrantFiled: February 2, 2004Date of Patent: July 4, 2006Assignee: FormFactor, Inc.Inventors: Makarand S. Shinde, Richard A. Larder, Timothy E. Cooper, Ravindra V. Shenoy, Benjamin N. Eldridge
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Patent number: 7071714Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: November 2, 2001Date of Patent: July 4, 2006Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Publication number: 20060001440Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: ApplicationFiled: August 30, 2005Publication date: January 5, 2006Inventors: Rod Martens, Benjamin Eldridge, Gary Grube, Ken Matsubayashi, Richard Larder, Makarand Shinde, Gaetan Mathieu
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Patent number: 6972578Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.Type: GrantFiled: May 31, 2002Date of Patent: December 6, 2005Assignee: FormFactor, Inc.Inventors: Rod Martens, Benjamin N. Eldridge, Gary W. Grube, Ken S. Matsubayashi, Richard A. Larder, Makarand Shinde, Gaetan L. Mathieu
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Publication number: 20050156611Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.Type: ApplicationFiled: February 2, 2004Publication date: July 21, 2005Applicant: FormFactor, Inc.Inventors: Makarand Shinde, Richard Larder, Timothy Cooper, Ravindra Shenoy, Benjamin Eldridge
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Publication number: 20040142583Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.Type: ApplicationFiled: December 29, 2003Publication date: July 22, 2004Applicant: FormFactor, Inc.Inventors: Gaetan L. Mathieu, Benjamin N. Eldridge, Gary W. Grube, Richard A. Larder