Patents by Inventor Richard Lee Ammlung

Richard Lee Ammlung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabricating a semiconductor device using fully cured bisbenzocyclobutene
    Patent number: 6977212
    Abstract: The present invention is a method of fabricating a semiconductor device using a fully cured BCB layer and removing the same using wet etching. The first step is selecting a substrate. The second step of the method is producing an oxide layer or other coating on the substrate. The third step is applying a BCB layer on the oxide layer. The fourth step is fully curing the BCB layer. The fifth step is processing the device. The sixth step is stressing the substrate, preferably causing the substrate to warp. The seventh step is wet etching the BCB layer. The eighth step is removing the BCB layer. The ninth step is removing the oxide layer.
    Type: Grant
    Filed: January 8, 2004
    Date of Patent: December 20, 2005
    Assignee: The United States of America as represented by the National Security Agency
    Inventors: Richard Lee Ammlung, David Jerome Mountain