Patents by Inventor Richard Lee Morris

Richard Lee Morris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular array and circuits for ultrasound transducers
    Patent number: 8754574
    Abstract: Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: June 17, 2014
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Richard Lee Morris, David A. Petersen
  • Modular Array and Circuits for Ultrasound Transducers
    Publication number: 20120267981
    Abstract: Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
    Type: Application
    Filed: April 20, 2011
    Publication date: October 25, 2012
    Applicant: SIEMENS MEDICAL SOLUTIONS USA, INC.
    Inventors: Richard Lee Morris, David A. Petersen