Patents by Inventor Richard Lee Smith, Jr.

Richard Lee Smith, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7335296
    Abstract: A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: February 26, 2008
    Assignee: Tohoku Techno Arch Co., Ltd.
    Inventors: Kunio Arai, Hiroshi Inomata, Richard Lee Smith, Jr.
  • Publication number: 20040232072
    Abstract: A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).
    Type: Application
    Filed: February 17, 2004
    Publication date: November 25, 2004
    Inventors: Kunio Arai, Hiroshi Inomata, Richard Lee Smith, Jr.