Patents by Inventor Richard Lee Warner

Richard Lee Warner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10828658
    Abstract: A microfluidic cartridge is provided. The microfluidic cartridge has a reservoir configured to contain a fluid composition. The microfluidic cartridge has a first face with a first opening and a second opening. The microfluidic cartridge also includes a second face joined with the first face, a third face joined with the second face and opposing the first face, and a fourth face joined with the third face and the first face and opposing the second face. The fourth face has a connector. The microfluidic cartridge has an electrical circuit with a first end portion disposed on the first face and a second end portion disposed on the second face. The microfluidic cartridge also includes a microfluidic die disposed on the second face. The microfluidic die is in electrical communication with the electrical circuit and in fluid communication with the reservoir.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: November 10, 2020
    Assignee: The Procter & Gamble Company
    Inventors: Dana Paul Gruenbacher, William Michael Cannon, James Daniel Anderson, Jr., Richard Lee Warner
  • Publication number: 20200001319
    Abstract: A microfluidic cartridge is provided. The microfluidic cartridge has a reservoir configured to contain a fluid composition. The microfluidic cartridge has a first face with a first opening and a second opening. The microfluidic cartridge also includes a second face joined with the first face, a third face joined with the second face and opposing the first face, and a fourth face joined with the third face and the first face and opposing the second face. The fourth face has a connector. The microfluidic cartridge has an electrical circuit with a first end portion disposed on the first face and a second end portion disposed on the second face. The microfluidic cartridge also includes a microfluidic die disposed on the second face. The microfluidic die is in electrical communication with the electrical circuit and in fluid communication with the reservoir.
    Type: Application
    Filed: August 15, 2019
    Publication date: January 2, 2020
    Inventors: Dana Paul GRUENBACHER, William Michael CANNON, James Daniel ANDERSON, JR., Richard Lee WARNER
  • Patent number: 10307783
    Abstract: A microfluidic cartridge is provided. The microfluidic cartridge is configured to be releasably connectable with a microfluidic delivery device. The microfluidic cartridge has a reservoir configured to contain a fluid composition. The microfluidic cartridge has a first face with a first opening and a second opening. The microfluidic cartridge also includes a second face joined with the first face, a third face joined with the second face and opposing the first face, and a fourth face joined with the third face and the first face and opposing the second face. The fourth face has a connector. The microfluidic cartridge has an electrical circuit with a first end portion disposed on the first face and a second end portion disposed on the second face. The microfluidic cartridge also includes a microfluidic die disposed on the second face. The microfluidic die is in electrical communication with the electrical circuit and in fluid communication with the reservoir.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: June 4, 2019
    Assignee: The Procter & Gamble Company
    Inventors: Dana Paul Gruenbacher, William Michael Cannon, James Daniel Anderson, Jr., Richard Lee Warner
  • Publication number: 20080083700
    Abstract: Methods for processing wafers, wafer processing apparatus, micro-fluid ejection head substrates, and etching process are provided. One such method includes applying a clamping voltage to an electrostatic chuck sufficient to hold a wafer in a substantially planerized orientation adjacent to the electrostatic chuck. A heat transfer fluid flows through a three dimensional space between the wafer and the electrostatic chuck to cool the wafer by convective heat transfer during wafer processing.
    Type: Application
    Filed: November 21, 2006
    Publication date: April 10, 2008
    Applicant: LEXMARK INTERNATIONAL, INC.
    Inventors: David Laurier Bernard, Paul William Dryer, John William Krawczyk, Andrew Lee McNees, Girish Shivaji Patil, Richard Lee Warner