Patents by Inventor Richard Lidio Blanco

Richard Lidio Blanco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10121997
    Abstract: A battery module includes a housing that defines an inner volume and includes an airflow path from an aperture formed in a first end member of the housing, through the inner volume, to an aperture formed in a second end member of the housing; power cells mounted in the inner volume of the housing, where each of the power cells includes a vent member; and a barrier that at least partially interrupts a fluid pathway that extends between the vent members and at least one of the aperture formed in the first end member or the aperture formed in the second end member of the housing. The power cells are directionally mounted in the volume such that the vent members face an offset direction relative to at least one of the aperture formed in the first end member or the aperture formed in the second end member of the housing.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: November 6, 2018
    Assignee: Google LLC
    Inventors: Richard Lidio Blanco, Philippe H. Gow
  • Publication number: 20160093842
    Abstract: A battery module includes a housing that defines an inner volume and includes an airflow path from an aperture formed in a first end member of the housing, through the inner volume, and to an aperture formed in a second end member of the housing; a plurality of power cells mounted in the inner volume of the housing, each of the power cells including a vent member at an end of the power cell; and a flame arrestor mounted across the airflow path and between the plurality of power cells and the aperture formed in the second end member of the housing. The flame arrestor includes a screen that includes a plurality of fluid pathways sized to allow an airflow from the airflow path through the fluid pathways and sized to impede a combusted fluid to pass therethrough.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Inventors: Richard Lidio Blanco, Dave Alexander, William Leslie Dailey, Philippe H. Gow
  • Patent number: 9257804
    Abstract: The present disclosure provides various bus bar connectors configured to draw power from a bus bar at non-discrete locations. In one aspect, a bus bar connector may include a connector housing having a slot. The slot may be configured to allow the connector housing to grip a bus bar at different locations. First and second electrical contacts may be disposed on opposite sides of the slot. The bus bar connector includes mounting members for securing the connector housing against an enclosure for the bus bar and a spring clip that can be to attach to upper and lower outer surfaces of the connector housing to provide an amount of contact force onto the outer surface of the connector housing. The amount of contact force enables the first and second electrical contacts to securely grip the bus bar.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: February 9, 2016
    Assignee: Google Inc.
    Inventors: Jonathan David Beck, Jeffrey Scott Spaulding, Debosmita Das, Richard Lidio Blanco, Mark Ramon Imbertson
  • Patent number: 8564955
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: October 22, 2013
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
  • Patent number: 8305728
    Abstract: Embodiments provide various apparatus and techniques for deflecting or redirecting a flow of ionized air generated from an ionic wind generator. In general, a deflection field generator can be located proximate to the path of the flow of ionized air. The deflection field generator is configured to generate an electromagnetic field, which deflects a least a portion of the flow of ionized air to a different path and may possibly increase local heat transfer.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: November 6, 2012
    Assignee: Apple Inc.
    Inventors: Jean L. Lee, Richard Lidio Blanco, Jr.
  • Patent number: 8215012
    Abstract: A method of manufacturing a thermal contact arrangement. The method including the operations of providing a thermal conductor and forming a first zone having a first roughness on a first portion of a first exterior surface of the thermal conductor. The method further including the operation of forming a second zone having a second roughness on a second portion of the first exterior surface of the thermal conductor. The second portion is unique from the first portion and formed from a part of the thermal contact arrangement other than the first portion and the second roughness is rougher than the first roughness.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: July 10, 2012
    Assignee: Apple Inc.
    Inventor: Richard Lidio Blanco, Jr.
  • Publication number: 20120002342
    Abstract: Embodiments provide various apparatus and techniques for deflecting or redirecting a flow of ionized air generated from an ionic wind generator. In general, a deflection field generator can be located proximate to the path of the flow of ionized air. The deflection field generator is configured to generate an electromagnetic field, which deflects a least a portion of the flow of ionized air to a different path and may possibly increase local heat transfer.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 5, 2012
    Applicant: Apple Inc.
    Inventors: Jean L. Lee, Richard Lidio Blanco
  • Publication number: 20110228482
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Application
    Filed: June 1, 2011
    Publication date: September 22, 2011
    Applicant: APPLE INC.
    Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice
  • Patent number: 7961469
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: June 14, 2011
    Assignee: Apple Inc.
    Inventors: Chad C Schmidt, Richard Lidio Blanco, Jr., Douglas L Heirich, Michael D Hillman, Phillip L Mort, Jay S Nigen, Gregory L Tice
  • Patent number: 7838418
    Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.
    Type: Grant
    Filed: December 11, 2007
    Date of Patent: November 23, 2010
    Assignee: Apple Inc.
    Inventors: Michael D. Hillman, Gregory L. Tice, Oscar Woo, Amir Salehi, Richard Lidio Blanco, Jr., Ronald J. Smith, Sean A. Bailey, Anwyl M. McDonald, Clayton R. Anderson, James M. Crowder, Jeffrey J. Van Norden, Jonathan N. Urquhart
  • Publication number: 20100246133
    Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: APPLE INC.
    Inventors: Chad C. Schmidt, Richard Lidio Blanco, JR., Douglas L. Heirich, Michael D. Hillman, Phillip L. Mort, Jay S. Nigen, Gregory L. Tice
  • Patent number: 7701716
    Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: April 20, 2010
    Assignee: Apple Inc.
    Inventors: Richard Lidio Blanco, Jr., Douglas L. Heirich
  • Publication number: 20090316359
    Abstract: Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.
    Type: Application
    Filed: June 18, 2008
    Publication date: December 24, 2009
    Applicant: APPLE INC.
    Inventors: Richard Lidio Blanco, JR., Douglas L. Heirich
  • Publication number: 20090149021
    Abstract: Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 11, 2009
    Applicant: APPLE INC.
    Inventors: Michael D. Hillman, Gregory L. Tice, Oscar Woo, Amir Salehi, Richard Lidio Blanco, JR., Ronald J. Smith, Sean A. Bailey, Anwyl M. McDonald, Clayton R. Anderson, James M. Crowder, Jeffrey J. VanNorden, Jonathan N. Urquhart
  • Publication number: 20090146294
    Abstract: Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 11, 2009
    Applicant: APPLE INC.
    Inventors: Michael D. Hillman, Gregory L. Tice, Oscar Woo, Richard Lidio Blanco, JR., Ronald J. Smith, Sean A. Bailey, Anwyl M. McDonald, Clayton R. Anderson, Yves C. Martin, Theodore G. Van Kessel
  • Publication number: 20090145802
    Abstract: Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region.
    Type: Application
    Filed: December 11, 2007
    Publication date: June 11, 2009
    Applicant: APPLE INC.
    Inventors: Michael D. Hillman, Gregory L. Tice, Oscar Woo, Richard Lidio Blanco, JR., Ronald J. Smith, Sean A. Bailey, Anwyl M. McDonald, Clayton R. Anderson
  • Publication number: 20090044407
    Abstract: A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.
    Type: Application
    Filed: October 2, 2008
    Publication date: February 19, 2009
    Applicant: Apple Inc.
    Inventor: Richard Lidio Blanco, JR.
  • Patent number: 7440281
    Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: October 21, 2008
    Assignee: Apple Inc.
    Inventors: Sean Ashley Bailey, Richard Lidio Blanco, Jr., David Edwards, Supratik Guha, Michael David Hillman, Yves C. Martin, Phillip Lee Mort, Roger Schmidt, Prabjit Singh, Ronald Jack Smith, Gregory L. Tice, Theodore Gerard van Kessel
  • Patent number: 7433191
    Abstract: A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: October 7, 2008
    Assignee: Apple Inc.
    Inventor: Richard Lidio Blanco, Jr.
  • Publication number: 20080191729
    Abstract: An apparatus that performs electrical testing is described. This apparatus includes a first semiconductor die that is to be tested, and a connector configured to be coupled to a first surface of the first semiconductor die. Furthermore, a thermal interface in the apparatus is between a second surface of the first semiconductor die and a heat-removal device. This thermal interface includes a metal which is in a liquid state at an operating temperature of the semiconductor die during the testing.
    Type: Application
    Filed: February 9, 2007
    Publication date: August 14, 2008
    Inventors: Richard Lidio Blanco, Michael D. Hillman