Abstract: Embodiments herein report compositions, uses and manufacturing of dengue virus constructs and live attenuated dengue viruses. Some embodiments concern a composition that includes, but is not limited to, a tetravalent dengue virus composition. In certain embodiments, compositions can include constructs of one or more serotypes of dengue virus, such as dengue-1 (DEN-1) virus, dengue-2 (DEN-2) virus, dengue-3 (DEN-3) or dengue-4 (DEN-4) virus constructs. In other embodiments, constructs disclosed herein can be combined in a composition to generate a vaccine against more one or more dengue virus constructs that may or may not be subsequently passaged in mammalian cells.

Abstract: A modifiable circuit structure and its method of formation are disclosed. The modifiable circuit structure electrically couples one portion of an interconnect with another portion of the interconnect through vias disposed in a dielectric layer. The combination of the modifiable circuit structure, the interconnect portions, and the vias provide a signal path between transistors in an integrated circuit. In one embodiment the modifiable circuit structure is a polysilicon feature formed over regions of a semiconductor substrate. In an alternative embodiment, the modifiable circuit structure is a diffusion region formed in region the semiconductor substrate.

Abstract: A modifiable circuit structure and its method of formation are disclosed. The modifiable circuit structure electrically couples one portion of an interconnect with another portion of the interconnect through vias disposed in a dielectric layer. The combination of the modifiable circuit structure, the interconnect portions, and the vias provide a signal path between transistors in an integrated circuit. In one embodiment the modifiable circuit structure is a polysilicon feature formed over regions of a semiconductor substrate. In an alternative embodiment, the modifiable circuit structure is a diffusion region formed in regions the semiconductor substrate.

Abstract: Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller dimensions and facilitate nano-machining endpoint detection in some embodiments.

Abstract: In one embodiment, the present invention includes a method. In the method, a fiducial transistor is provided in an integrated circuit. Also in the method, a power conductor is coupled to a first terminal of the transistor. Also in the method, a ground conductor is coupled to a second terminal of the transistor. Also in the method, a control conductor is coupled to a third terminal of the transistor. Also in the method, other circuitry is provided, the other circuitry is operatively decoupled from the fiducial transistor and the other circuitry is operable without the fiducial transistor.

Abstract: In one embodiment, the present invention includes a method. In the method, a fiducial transistor is provided in an integrated circuit. Also in the method, a power conductor is coupled to a first terminal of the transistor. Also in the method, a ground conductor is coupled to a second terminal of the transistor. Also in the method, a control conductor is coupled to a third terminal of the transistor. Also in the method, other circuitry is provided, the other circuitry is operatively decoupled from the fiducial transistor and the other circuitry is operable without the fiducial transistor.

Abstract: In one embodiment, the present invention includes a method. In the method, a fiducial transistor is provided in an integrated circuit. Also in the method, a power conductor is coupled to a first terminal of the transistor. Also in the method, a ground conductor is coupled to a second terminal of the transistor. Also in the method, a control conductor is coupled to a third terminal of the transistor. Also in the method, other circuitry is provided, the other circuitry is operatively decoupled from the fiducial transistor and the other circuitry is operable without the fiducial transistor.

Abstract: In one embodiment, the present invention includes a method including the following acts. A light source is scanned over a surface of an integrated circuit. A photo-induced current is measured from a fiducial in the integrated circuit. The current is correlated to a position of the light source as the scanning progresses.

Abstract: In one embodiment, the present invention includes a method including the following acts. A light source is scanned over a surface of an integrated circuit. A photo-induced current is measured from a fiducial in the integrated circuit. The current is correlated to a position of the light source as the scanning progresses.

Abstract: In one embodiment, the present invention includes a method including the following acts. A light source is scanned over a surface of an integrated circuit. A photo-induced current is measured from a fiducial in the integrated circuit. The current is correlated to a position of the light source as the scanning progresses.