Abstract: A method for identifying a current state of an electronic system is provided. The method includes identifying a pool of candidate states of the electronic system, selecting a probing parameter in accordance with a model, and probing the electronic system based on the selected probing parameter. When the probing yields a positive result, all candidate states that are not intersected by the probing parameter are removed from the pool. When the probing parameter yields M negative results, all candidate states that are intersected by the probing parameter are removed from the pool, where M?1. A last remaining candidate state in the pool is identified as the current state of the electronic system. The model is based on at least one of a probability that the probing would yield a false-negative result or a probability that a result of the probing would be interpreted and/or processed incorrectly.

Abstract: The invention is directed to a cable breakout assembly (1) comprising a first gland for a feeder cable (10) and several second glands (13) for power feeder subassemblies (12) and an enclosure (2) comprising at least one carrier (3). The at least one carrier is suitable to be interconnected to at least one second gland.

Abstract: The invention is directed to a cable breakout assembly (1) comprising a first gland for a feeder cable (10) and several second glands (13) for power feeder subassemblies (12) and an enclosure (2) comprising at least one carrier (3). The at least one carrier is suitable to be interconnected to at least one second gland.

Abstract: The invention relates to a test adapter (1) for operatively connecting a chip to be tested to a test device. The test adapter has a three-dimensional construction with a baseplate (8) and a cover plate (2). The cover plate (2) has a contact array (3) having contact elements (9) coordinated with the chip to be tested in terms of number and arrangement. Arranged between the baseplate (8) and the cover plate (2) are side walls (4) which are arranged at an angle with respect to the cover plate (2) and have a number of individual connectors (5) that is coordinated with the chip to be tested.

Abstract: The invention relates to a test adapter (1) for operatively connecting a chip to be tested to a test device. The test adapter has a three-dimensional construction with a baseplate (8) and a cover plate (2). The cover plate (2) has a contact array (3) having contact elements (9) coordinated with the chip to be tested in terms of number and arrangement. Arranged between the baseplate (8) and the cover plate (2) are side walls (4) which are arranged at an angle with respect to the cover plate (2) and have a number of individual connectors (5) that is coordinated with the chip to be tested.