Patents by Inventor Richard Lytel

Richard Lytel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of integrating a heat spreader and a semiconductor, and package formed thereby
    Patent number: 6586279
    Abstract: A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperature to form a heat spreader.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: July 1, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Howard L. Davidson, Richard Lytel