Patents by Inventor Richard M. Ainza

Richard M. Ainza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTILAYER DICING BLADE
    Publication number: 20080092714
    Abstract: A semiconductor dicing blade comprising a blade body, a first grit located within a core of the blade body, and a second different grit located on a side surface of the blade body wherein the first grit has a first grit size and is exposed at a lead cutting edge of the blade body, and wherein a largest grit particle of the second different grit is smaller than a smallest grit particle of the first grit. A method of cutting a semiconductor wafer is also provided.
    Type: Application
    Filed: October 9, 2006
    Publication date: April 24, 2008
    Applicant: Texas Instruments Incorporated
    Inventors: Ariel L. Miranda, Jeniffer V. Otero, Richard M. Ainza