Patents by Inventor Richard M. Catlin, Jr.

Richard M. Catlin, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5280983
    Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
    Type: Grant
    Filed: October 19, 1992
    Date of Patent: January 25, 1994
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway
  • Patent number: 5224809
    Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
    Type: Grant
    Filed: December 30, 1991
    Date of Patent: July 6, 1993
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway
  • Patent number: 4911597
    Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
    Type: Grant
    Filed: August 25, 1987
    Date of Patent: March 27, 1990
    Assignee: Applied Materials, Inc.
    Inventors: Dan Maydan, Sasson R. Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov, Lance S. Reinke, J. Christopher Moran, Richard M. Catlin, Jr., Robert B. Lowrance, Gregory W. Ridgeway