Abstract: A system may include a plurality of information handling systems and a manifold fluidically coupled to each of the plurality of information handling systems via respective fluidic conduits and further configured to couple to a cooling distribution unit, the manifold comprising a plurality of variable valves wherein the variable valves are programmable to control a flow rate of coolant fluid through the variable valves in order to independently control a first flow rate of the coolant fluid to a first information handling system of the plurality of information handling systems and a second flow rate of the coolant fluid to a second information handling system of the plurality of information handling systems.

Abstract: An information handling system may include a chassis configured to house a plurality of information handling resources, one or more air movers internal to the chassis and arranged to drive airflow proximate to the plurality of information handling systems, and an air-to-liquid radiator internal to the chassis and arranged such that the airflow flows proximate to the air-to-liquid radiator to cool airflow internal to the chassis prior to flowing proximate to at least one of the information handling resources.

Abstract: A method may include receiving power information from an information handling resource regarding an amount of electrical power consumed by the information handling resource, receiving first temperature information from a first temperature sensor regarding a first temperature, receiving second temperature information from the second temperature sensor regarding a second temperature, and based on the power information, the first temperature information, and the second temperature information, estimating a fluid flow rate of the liquid coolant through the liquid cooling system.

Abstract: An information handling system may include a motherboard, an information handling resource, a heat spreader thermally coupled to the information handling resource, and a load plate mechanically coupled to the motherboard in order to maintain electrical and mechanical coupling of the information handling resource to the motherboard. The load plate may include a body at least partially overlapping with and mechanically coupled to the heat spreader when the load plate is mechanically coupled to the motherboard, an opening formed within the body and configured to expose the heat spreader through the opening when the load plate is mechanically coupled to the motherboard, and an angled feature formed at one edge of a perimeter of the opening and decreasing in depth from the opening to the body.

Abstract: A system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, a management controller for providing out-of-band management of the system, and a flow-rate sensor coupled to the liquid cooling system and configured to measure a volume of flow of fluid through a fluidic channel of the liquid cooling system per unit time and communicate one or more signals to the management controller indicative of the volume of the flow of the fluid through the fluidic channel of the liquid cooling system per unit time.

Abstract: A fluid fitting may include a housing having a fluidic channel formed within, configured to convey fluid between a first end of the housing and a second end of the housing, a temperature sensor configured to generate a signal indicative of a temperature of fluid flowing in the fluidic channel, and a wiring channel formed in the housing and configured to house at least a portion of an electrically-conductive path extending from the temperature sensor to the exterior of the housing, the electrically-conductive path configured to communicate the signal from the temperature sensor.

Abstract: An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.

Abstract: An information handling system includes a chassis having multiples sleds and an embedded controller. The embedded controller retrieves relative impedances for all of the sleds, and calculates a maximum available airflow for the first sled based the relative impedances of all other sleds. A baseboard management controller (BMC) of a first sled requests a boot operation for the first sled. The BMC collects configuration information for the first sled, and determines an airflow impedance of the first sled based on the configuration information. The BMC provides the airflow impedance and a power allocation request to the embedded controller. The BMC compares the maximum available airflow to a minimum airflow requirement for the first sled. If the maximum available airflow is less than the minimum airflow requirement, the BMC implements power limits for processors in the first sled to prevent overheating of components within the first sled.