Abstract: An apparatus, a method, and a system. The method includes implementing an erase operation on a deck of a superblock, block or subblock of a three-dimensional (3D) non-volatile memory device to obtain an erased deck; applying a dummy read pulse to one or more wordlines (WLs) of a to-be-read deck of the superblock, block or subblock; and implementing, after application of the dummy read pulse, a read operation on one or more memory cells corresponding to the one or more WLs to read data from the one or more memory cells.

Abstract: An apparatus, a method, and a system. The method includes implementing an erase operation on a deck of a superblock, block or subblock of a three-dimensional (3D) non-volatile memory device to obtain an erased deck; applying a dummy read pulse to one or more wordlines (WLs) of a to-be-read deck of the superblock, block or subblock; and implementing, after application of the dummy read pulse, a read operation on one or more memory cells corresponding to the one or more WLs to read data from the one or more memory cells.

Abstract: An apparatus, a method, and a system. The method includes implementing an erase operation on a deck of a superblock, block or subblock of a three-dimensional (3D) non-volatile memory device to obtain an erased deck; applying a dummy read pulse to one or more wordlines (WLs) of a to-be-read deck of the superblock, block or subblock; and implementing, after application of the dummy read pulse, a read operation on one or more memory cells corresponding to the one or more WLs to read data from the one or more memory cells.

Abstract: A method, apparatus, and tangible computer readable medium for processing a Hidden Markov Model (HMM) structure are disclosed herein. For example, the method includes receiving Hidden Markov Model (HMM) information from an external system. The method also includes processing back pointer data and first HMM states scores for one or more NULL states in the HMM information. Second HMM state scores are processed for one or more non-NULL states in the HMM information based on at least one predecessor state. Further, the method includes transferring the second HMM state scores to the external system.

Abstract: Embodiments include a method, apparatus, and a computer program product for combining results from multiple decoders. For example, the method can include generating a network of paths based on one or more outputs associated with each of the multiple decoders. The network of paths can be scored to find an initial path with the highest path score based on scores associated with the one or more outputs. A weighting factor can be calculated for each of the multiple decoders based on a number of outputs from each of the multiple decoders included in the initial path with the highest path score. Further, the network of paths can be re-scored to find a new path with the highest path score based on the scores associated with the one or more outputs and the weighting factor for each of the multiple decoders.

Abstract: Embodiments of the present invention include an acoustic processing device and a method for traversing a Hidden Markov Model (HMM). The acoustic processing device can include a senone scoring unit (SSU), a memory device, a HMM module, and an interface module. The SSU is configured to receive feature vectors from an external computing device and to calculate senones. The memory device is configured to store the senone scores and HMM information, where the HMM information includes HMM IDs and HMM state scores. The HMM module is configured to traverse the HMM based on the senone scores and the HMM information. Further, the interface module is configured to transfer one or more HMM scoring requests from the external computing device to the HMM module and to transfer the HMM state scores to the external computing device.

Abstract: Embodiments of the present invention include a data storage device and a method for storing data in a hash table. The data storage device can include a first memory device, a second memory device, and a processing device. The first memory device is configured to store one or more data elements. The second memory device is configured to store one or more status bits at one or more respective table indices. In addition, each of the table indices is mapped to a corresponding table index in the first memory device. The processing device is configured to calculate one or more hash values based on the one or more data elements.

Abstract: A method of operation of a real-time data-pattern analysis system includes: providing a memory module, a computational unit, and an integrated data transfer module arranged within an integrated circuit die; storing a data pattern within the memory module; transferring the data pattern from the memory module to the computational unit using the integrated data transfer module; and comparing processed data to the data pattern using the computational unit.

Abstract: Embodiments of the present invention include a data storage device and a method for storing data in a hash table. The data storage device can include a first memory device, a second memory device, and a processing device. The first memory device is configured to store one or more data elements. The second memory device is configured to store one or more status bits at one or more respective table indices. In addition, each of the table indices is mapped to a corresponding table index in the first memory device. The processing device is configured to calculate one or more hash values based on the one or more data elements.

Abstract: Embodiments of the present invention include an acoustic processing device and a method for traversing a Hidden Markov Model (HMM). The acoustic processing device can include a senone scoring unit (SSU), a memory device, a HMM module, and an interface module. The SSU is configured to receive feature vectors from an external computing device and to calculate senones. The memory device is configured to store the senone scores and HMM information, where the HMM information includes HMM IDs and HMM state scores. The HMM module is configured to traverse the HMM based on the senone scores and the HMM information. Further, the interface module is configured to transfer one or more HMM scoring requests from the external computing device to the HMM module and to transfer the HMM state scores to the external computing device.

Abstract: A metal oxide semiconductor field effect transistor (MOSFET) with source side punch-through protection implant. Specifically, the MOSFET comprises a semiconductor substrate, a gate stack formed above the semiconductor substrate, source and drain regions, and a protection implant. The semiconductor substrate comprises a first p-type doping concentration. The source and drain regions comprise an n-type doping concentration, and are formed on opposing sides of the gate stack in the semiconductor substrate. The protection implant comprises a second p-type doping concentration, and is formed in the semiconductor substrate under the source region and surrounds the source region in order to protect the source region from the depletion region corresponding to the drain region.

Abstract: A metal oxide semiconductor field effect transistor (MOSFET) with source side punch-through protection implant. Specifically, the MOSFET comprises a semiconductor substrate, a gate stack formed above the semiconductor substrate, source and drain regions, and a protection implant. The semiconductor substrate comprises a first p-type doping concentration. The source and drain regions comprise an n-type doping concentration, and are formed on opposing sides of the gate stack in the semiconductor substrate. The protection implant comprises a second p-type doping concentration, and is formed in the semiconductor substrate under the source region and surrounds the source region in order to protect the source region from the depletion region corresponding to the drain region.

Abstract: A method of operation of a real-time data-pattern analysis system includes: providing a memory module, a computational unit, and an integrated data transfer module arranged within an integrated circuit die; storing a data pattern within the memory module; transferring the data pattern from the memory module to the computational unit using the integrated data transfer module; and comparing processed data to the data pattern using the computational unit.

Abstract: Tunnel dielectrics for semiconductor devices are generally described. In one example, an apparatus includes a semiconductor substrate, a first tunnel dielectric having a first bandgap coupled to the semiconductor substrate, a second tunnel dielectric having a second bandgap coupled to the first tunnel dielectric, and a third tunnel dielectric having a third bandgap coupled to the second tunnel dielectric wherein the second bandgap is relatively smaller than the first bandgap and the third bandgap.

Abstract: A flash memory cell and a method of forming the same are described. The flash memory cell may include a substrate having a source and a drain, a gate element, and a dielectric layer between the substrate and the gate element. The dielectric layer includes a dielectric material having a dielectric constant that is greater than that of silicon dioxide.

Abstract: A memory cell and a method of forming the same are described. The memory cell is formed on a substrate. The memory cell includes a floating gate that is formed at least in part within the substrate. A bit line region is formed within the substrate in proximity to the floating gate. Because of the configuration of the bit line and the floating gate, memory cells can be located closer to each other, increasing the density of memory cells in a memory array.

Abstract: A method and apparatus for coupling to a source line. Specifically, embodiments of the present invention disclose a memory device comprising an array of flash memory cells with a source line connection that facilitates straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column implanted with n-type dopants is also isolated between an adjoining pair of STI regions. The source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions in the array. A source contact is coupled to the source column for providing electrical coupling with the plurality of source regions. The source contact is located along a row of drain contacts that are coupled to drain regions of a row of memory cells.

Abstract: A new method for improving the accuracy of read-write operations in a multi-level flash memory cell is disclosed. The method reduces the read margin disturbance caused by the accumulation of holes at a tunneling oxide or tunneling oxide-silicon interface underneath a floating gate of the cell by applying a positive stress to the word line after a program-erase cycle.

Abstract: A method of erasing bits in a multi-level cell flash memory array is described. The method includes applying over-erase verification after each erase pulse. If cells verify as over-erased, a ramped over-erase correction pulse is applied. The voltage of each over-erase correction pulse is incrementally greater than the previous pulse, until all bits in all cells pass the over-erase verification. In this way, the widths of the threshold voltage distributions of the erased bits are kept to a minimum.

Abstract: A semiconductor component having a memory cell coupled to a trench line and a method for manufacturing the semiconductor component. Trenches having sidewalls are formed in a semiconductor substrate and a trench line is formed in each trench. A polysilicon insert is formed between the trench line and each sidewall of the trench. A column of memory cells is formed between the trenches where each memory cell of the column of memory cells has a gate structure, a source region, and a drain region. The source regions of the column of memory cells are electrically coupled to the trench line on one side of the column of memory cells via one of the polysilicon inserts. The drain regions of the column of memory cells are electrically coupled to the trench line adjacent the opposite side of the column of memory cells via another of the polysilicon inserts.