Patents by Inventor Richard M. Levering, Jr.

Richard M. Levering, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method relating to a polishing system having a multi-phase polishing layer
    Patent number: 6488570
    Abstract: A method of making a polishing pad composition comprising a high modulus phase component and a low modulus phase component, and a method of polishing a semiconductor substrate by creating nanoasperities at a polishing interface between the polishing layer and the wafer during polishing by providing the high modulus phase component at the polishing interface, either as protrusions from the polishing layer, or by being released from the polishing layer into the polishing interface.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: December 3, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Lee Melbourne Cook
  • Polishing system having a multi-phase polishing substrate and methods relating thereto
    Patent number: 6375559
    Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 23, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Lee Melbourne Cook
  • Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
    Patent number: 6337281
    Abstract: A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
    Type: Grant
    Filed: March 8, 2000
    Date of Patent: January 8, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Heinz F. Reinhardt
  • Method of fabricating a porous polymeric material by electrophoretic deposition
    Patent number: 6284114
    Abstract: A method is provided for the fabrication of a porous polymeric material by electrophoretic deposition. The porous polymeric material is particularly well suited as a polishing surface for the planarization of semiconductor wafers.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: September 4, 2001
    Assignee: Rodel Holdings Inc.
    Inventors: Nina G. Chechik, Richard M. Levering, Jr., David B. James, Lee Melbourne Cook
  • Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
    Patent number: 6245679
    Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
    Type: Grant
    Filed: February 3, 2000
    Date of Patent: June 12, 2001
    Assignee: Rodel Holdings, Inc
    Inventors: Lee Melbourne Cook, David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr.
  • Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
    Patent number: 6210525
    Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: April 3, 2001
    Assignee: Rodel Holdings, Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Lee Melbourne Cook
  • Polishing system having a multi-phase polishing substrate and methods relating thereto
    Patent number: 6099394
    Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, polishing pad comprising a high modulus phase and a low modulus phase. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.
    Type: Grant
    Filed: March 27, 1998
    Date of Patent: August 8, 2000
    Assignee: Rodel Holdings, Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr.
  • Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
    Patent number: 6069080
    Abstract: A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
    Type: Grant
    Filed: August 24, 1998
    Date of Patent: May 30, 2000
    Assignee: Rodel Holdings, Inc.
    Inventors: David B. James, William D. Budinger, John V. H. Roberts, Michael R. Oliver, Nina G. Chechik, Richard M. Levering, Jr., Heinz F. Reinhardt