Patents by Inventor Richard M. Poliak

Richard M. Poliak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering flux
    Patent number: 4441938
    Abstract: A soldering flux comprising of rosin, certain acetic acid derivatives, ionic fluorocarbon surfactant, and organic diluent.
    Type: Grant
    Filed: March 29, 1983
    Date of Patent: April 10, 1984
    Assignee: International Business Machines Corporation
    Inventors: Richard M. Poliak, Dennis L. Rivenburgh, Carlos J. Sambucetti
  • Composition containing alcohol and use thereof for epoxy removal
    Patent number: 4294729
    Abstract: Cured epoxy compositions are removed from substrates by employing compositions containing an organic cyclic alcohol and a surface-active agent.
    Type: Grant
    Filed: December 17, 1979
    Date of Patent: October 13, 1981
    Assignee: International Business Machines Corporation
    Inventors: Peter Bakos, Russell E. Darrow, Joseph Funari, Richard M. Poliak
  • Polyimide coating process and material
    Patent number: 4238528
    Abstract: A protective layer composition, suitable for protecting metal electrodes on components and other microelectronic circuitry, comprises an organic thermoplastic polymeric material, an organic solvent or solvents, and a non-ionic fluorocarbon surfactant as a wetting/leveling/flow control agent. A typical formulation comprises an aromatic polymer which cures to form a polyamide-imide polymer, an organic solvent or a mixture of orangic solvents and a non-ionic fluorocarbon surfactant.
    Type: Grant
    Filed: October 2, 1979
    Date of Patent: December 9, 1980
    Assignee: International Business Machines Corporation
    Inventors: Raymond W. Angelo, Richard M. Poliak, John R. Susko
  • Sealing of integrated circuit modules
    Patent number: 4233620
    Abstract: The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.
    Type: Grant
    Filed: February 27, 1979
    Date of Patent: November 11, 1980
    Assignee: International Business Machines Corporation
    Inventors: Russell E. Darrow, Irving Memis, Richard M. Poliak
  • Removable protective coating and process of using same
    Patent number: 4216035
    Abstract: A film-forming composition comprising an organic flux base material; and a carboxylic acid anhydride and/or aldehyde; and a process for using are provided.
    Type: Grant
    Filed: December 23, 1977
    Date of Patent: August 5, 1980
    Assignee: International Business Machines Corporation
    Inventors: Peter Bakos, Roger E. Haggett, Richard M. Poliak