Patents by Inventor Richard M. Sutherland

Richard M. Sutherland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for use in fabricating a structure
    Patent number: 10022949
    Abstract: A system for use in fabricating a laminate structure from a plurality of layers of material is provided. The system includes a marker coupled to at least two of the plurality of layers, and a positioning system configured to arrange the plurality of layers in a predetermined layup position based on a position of the markers.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: July 17, 2018
    Assignee: The Boeing Company
    Inventors: Dallas Steven Scholes, Richard M. Sutherland, John F. Spalding, Robert J. Keeler
  • SYSTEM AND METHOD FOR USE IN FABRICATING A STRUCTURE
    Publication number: 20170157912
    Abstract: A system for use in fabricating a laminate structure from a plurality of layers of material is provided. The system includes a marker coupled to at least two of the plurality of layers, and a positioning system configured to arrange the plurality of layers in a predetermined layup position based on a position of the markers.
    Type: Application
    Filed: February 24, 2017
    Publication date: June 8, 2017
    Inventors: Dallas Steven Scholes, Richard M. Sutherland, John F. Spalding, Robert J. Keeler
  • System and method for use in fabricating a structure
    Patent number: 9610761
    Abstract: A system for use in fabricating a laminate structure from a plurality of layers of material is provided. The system includes a marker coupled to at least two of the plurality of layers, and a positioning system configured to arrange the plurality of layers in a predetermined layup position based on a position of the markers.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 4, 2017
    Assignee: The Boeing Company
    Inventors: Dallas Steven Scholes, Richard M. Sutherland, John F. Spalding, Robert J. Keeler
  • Apparatus, system, and method for in situ strength testing of a bonded joint
    Patent number: 9261444
    Abstract: The present disclosure relates to a system for testing the strength of a bonded joint between at least two components, wherein the system includes at least one element force energizer that creates an actual mechanical stress in the bonded joint when actuated, wherein the element force energizer is coupled with the at least two components. The system further includes an energy interface that is connectable to a power source, the energy interface being in electrical communication with the at least one element force energizer, and a sensor that detects the actual mechanical stress or strain in the bonded joint. The system may also include a recording device that records and/or transmits the detected mechanical stress or strain in the bonded joint. In one example, the element force energizers include piezoelectric materials.
    Type: Grant
    Filed: July 30, 2013
    Date of Patent: February 16, 2016
    Assignee: The Boeing Company
    Inventors: Richard M. Sutherland, Eugene A. Dan-Jumbo
  • SYSTEM AND METHOD FOR USE IN FABRICATING A STRUCTURE
    Publication number: 20140261959
    Abstract: A system for use in fabricating a laminate structure from a plurality of layers of material is provided. The system includes a marker coupled to at least two of the plurality of layers, and a positioning system configured to arrange the plurality of layers in a predetermined layup position based on a position of the markers.
    Type: Application
    Filed: March 12, 2013
    Publication date: September 18, 2014
    Applicant: THE BOEING COMPANY
    Inventors: Dallas Steven Scholes, Richard M. Sutherland, John F. Spalding, Robert J. Keeler
  • Method of preventing aluminum bond pad corrosion during dicing of integrated circuit wafers
    Patent number: 5461008
    Abstract: A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.
    Type: Grant
    Filed: May 26, 1994
    Date of Patent: October 24, 1995
    Assignee: Delco Electronics Corporatinon
    Inventors: Richard M. Sutherland, Howard E. Harrell, Wayne A. Sozansky, George C. Wolf