Abstract: According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.

Abstract: According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.

Abstract: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.

Abstract: According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.

Abstract: A variable universal life insurance product that includes a death benefit and associated investment vehicles is selectively offered. A life insurance policy chassis is provided by an insurance company to an asset manager. The asset manager combines the life insurance policy chassis with one or more associated investment vehicles managed by the asset manager to form a variable universal life insurance product. The asset manager selectively makes the insurance product available to respective clients of the asset manager. The insurance company providing service for the death benefit and the asset manager providing service for the associated investment vehicles.

Abstract: In certain embodiments, removing non-condensable gas from a cooling system includes trapping contents of a discharge tube of a heat exchanger, where the heat exchanger is in thermal communication with an ambient environment at an ambient temperature. The contents of the discharge tube comprises a vapor portion of a cooling fluid, a liquid portion of the cooling fluid, and a non-condensable gas. The cooling fluid is at a subambient pressure, and the ambient temperature is lower than a boiling point of the cooling fluid. A first additional portion of the cooling fluid is inlet into the discharge tube to increase a pressure within the discharge tube. The vapor portion of the cooling fluid within the discharge tube is allowed to condense. A second additional portion of the cooling fluid is inlet to purge the non-condensable gas from the discharge tube.

Abstract: According to one embodiment of the invention, an apparatus comprises a passive cooling system and a portion of an air vehicle which receives thermal energy. The passive cooling system is disposed adjacent the portion of the air vehicle and comprises a fluid transfer chamber. A fluid transfer element and a coolant are disposed within the fluid transfer chamber. The fluid transfer element wicks a portion of the coolant towards the portion of the air vehicle. The portion of the coolant wicked towards the portion of the air vehicle absorb at least a portion of the thermal energy in a boiling heat transfer.

Abstract: An apparatus includes heat-generating structure disposed in an environment having an ambient pressure, and a cooling system for removing heat from the heat-generating structure. The cooling system includes a fluid coolant, structure which reduces a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure; and structure which directs a flow of the liquid coolant at the subambient pressure so that it is brought into thermal communication with the heat-generating structure, the coolant then absorbing heat and changing to a vapor.

Abstract: According to one embodiment, a cooling apparatus has a number of cooling fins that are coupled to a heat pipe. The heat pipe has a hollow cavity that is at least partially filled with a refrigerant. Each of the cooling fins has a hollow cavity that is fluidly coupled to the hollow cavity of heat pipe such that the refrigerant may flow between the hollow cavity of the heat pipe and hollow cavities of the cooling fins.

Abstract: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.

Abstract: According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.

Abstract: According to one embodiment, a cooling system for heat-generating structures comprises a cooling loop and a heat exchanger. The cooling loop directs a flow of a fluid coolant to both an active heat-generating structure and an inactive heat-generating structure. The fluid coolant receiving thermal energy from the active heat-generating structure and transfers thermal energy to the inactive heat-generating structure when a temperature of the fluid coolant is greater than an ambient temperature of an environment surrounding the heat-generating structures. The active heat-generating structure is operable to switch to an inactive state and the inactive heat-generating structure is operable to switch to an active state. The heat exchanger is in thermal communication with the first and second heat-generating structures and is operable to receive the fluid coolant at a first temperature and dispense of the fluid coolant out of the heat exchanger at a second temperature.

Abstract: According to one embodiment, a cooling system for a heat-generating structure includes a first cooling loop that directs a flow of a first fluid coolant from a heat-generating structure to a first heat exchanger. The system also includes a second cooling loop that directs a flow of a second fluid coolant from the first heat exchanger to a second heat exchanger. The first heat exchanger receives thermal energy from the first fluid coolant and transfers at least a portion of the thermal energy to the second fluid coolant. The first fluid coolant has a specific heat and a mass flow rate, and the second fluid coolant has a specific heat and a mass flow rate. A product of the specific heat and the mass flow rate of the first fluid coolant is greater than a product of the specific heat and the mass flow rate of the second fluid coolant.

Abstract: According to one embodiment, a two-phase cooling system includes a condensing heat exchanger fluidly coupled to an evaporator assembly and a pressure controller. The condensing heat exchanger condenses a coolant from a vapor phase to a liquid phase by removing heat from the coolant. The evaporator assembly is thermally coupled to a vacuum tube and operable to receive liquid coolant from the condensing heat exchanger, cool the vacuum tube by evaporating the coolant from the liquid phase to the vapor phase, and transporting the evaporated coolant to the condensing heat exchanger. The pressure controller maintains the pressure of the coolant in the evaporator assembly at a sub-ambient pressure to lower the boiling point of the coolant for reducing the operating temperature of the vacuum tube.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.

Abstract: According to an embodiment of the invention, a cooling system for a heat-generating device comprises a base plate, a fluid transfer chamber, a non-metallic wicking material, and a coolant. The base plate is in thermal communication with a heat generating structure and is operable to communicate thermal energy from the heat-generating device. The non-metallic wicking material and the coolant are disposed within the fluid transfer chamber. The non-metallic wicking material wicks a portion of the coolant towards a portion of the base plate communicating the thermal energy. The portion of the coolant absorb at least a portion of the thermal energy communicated from the heat-generating device. The coolant comprising at least an alcohol and at least one additional fluid.

Abstract: According to one embodiment of the invention, a cooling system for a heat-generating structure includes a heating device, a cooling loop, and a separation structure. The heating device heats a flow of fluid coolant including a mixture of water and antifreeze. The cooling loop includes a director structure which directs the flow of the fluid coolant substantially in the form of a liquid to the heating device. The heating device vaporizes a substantial portion of the water into vapor while leaving a substantial portion of the antifreeze as liquid. The separation structure receives, from the heating device, the flow of fluid coolant with the substantial portion of the water as vapor and the substantial portion of the antifreeze as liquid.

Abstract: A heat exchanger extracts heat from a two-phase fluid coolant so that the coolant changes from a vapor state to a liquid state. Two valves have respective inlets which communicate with the coolant in the heat exchanger, and which are physically spaced from each other. Valve control structure responds to the presence of liquid at the inlet to either valve by opening that valve, so that the liquid coolant flows through the valve to a discharge section. A different feature involves a housing with a heat exchanger therein, the heat exchanger having a plurality of coolant conduits that are axially spaced. A flow of air travels axially within the housing, then flows transversely past the conduits to the other side thereof, and then resumes flowing axially on the other side of the conduits.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: A thermal management system is provided. The system has a thermal management apparatus which may be disposed adjacent to and connected with a heat source. The thermal management apparatus may include a body having a porous fluid transfer element disposed therein. The body may also have a heat transfer fluid disposed therein. The heat source may create relatively liquid-rich and liquid-poor regions within the thermal management apparatus. The wicking action of the porous fluid transfer element may be used to force heat transfer fluid from liquid-rich regions toward liquid-poor regions.