Patents by Inventor Richard M. Wootten

Richard M. Wootten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4282758
    Abstract: A method for destructive testing of the bond strength of each individual d of a chip beam-lead device which includes cutting the chip using a laser, laser cutting a hole through each individual piece of the chip with the lead attached to the chip and inserting a hook of a pull tester into the hole made in each chip section and pulling the chip section and the lead attached thereto to determine the bond strength between the lead of the chip and the conductor to which the lead is attached.
    Type: Grant
    Filed: December 20, 1979
    Date of Patent: August 11, 1981
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: Richard M. Wootten, Jake Herron, Jr.