Abstract: The invention relates to an electronic module, especially an optical transceiver module, including a casing, at least a portion of which consists of a thermally conductive material adapted to dissipate heat to the surrounding air or to a neighboring heat sink (heat dissipating portion); and a printed circuit board provided within the casing, the printed circuit board carrying at least one heat producing electronic device on a mounting surface thereof. A table-like heat dissipating element having one or more legs extending from a table top is provided on the mounting surface. The table top covers the at least one heat producing electronic device and the one or more legs contact the mounting surface in an area surrounding the at least one heat producing electronic device. An upper surface of the table top either directly or indirectly contacts an inner surface of the heat dissipating portion of the casing.

Abstract: The invention relates to a storage tray for protecting one or more optical fibers mechanically coupled to an optoelectronic device, characterized in that it is configured to be capable of coupling with the optoelectronic device, and comprising a fiber storage portion which is configured to receive and store the one or more optical fibers. The present invention also relates to an assembly comprising a storage tray according to the invention, and an optoelectronic device, wherein one or more optical fibers are coupled to the optoelectronic device, and wherein the one or more optical fibers are stored in the fiber storage portion of the storage tray.

Abstract: An electro-optical assembly comprises a substrate having a support-surface, and a photonic integrated circuit (PIC) mounted with a contact surface on the support-surface. The (PIC) comprises an integrated optical waveguide structure defining at least two waveguide end faces, at an edge surface of the PIC, perpendicular to its contact surface, and forming optical ports. An optical coupling device, mounted with a contact surface on the support-surface, optically connects at least two optical fibers to the PIC and comprises an optical waveguide structure-defining at least two front waveguide end faces provided at a front edge surface thereof, perpendicular to its contact surface. The number of front waveguide end faces corresponds to the number of the waveguide end faces. The optical coupling device is positionable during an active positioning process to align the respective waveguide end faces. A method of manufacturing such an electro-optical assembly is also provided.

Abstract: The invention relates to a storage tray for protecting one or more optical fibers mechanically coupled to an optoelectronic device, characterized in that it is configured to be capable of coupling with the optoelectronic device, and comprising a fiber storage portion which is configured to receive and store the one or more optical fibers. The present invention also relates to an assembly comprising a storage tray according to the invention, and an optoelectronic device, wherein one or more optical fibers are coupled to the optoelectronic device, and wherein the one or more optical fibers are stored in the fiber storage portion of the storage tray.

Abstract: An electro-optical assembly comprises a substrate having a support surface, and a photonic integrated circuit (PIC) which is mounted with a contact surface on the support surface. The PIC comprises an integrated optical waveguide structure defining at least two waveguide end faces, at an edge surface of the PIC, perpendicular to its contact surface, and forming optical ports An optical coupling device, mounted with a contact surface on the support surface, optically connects at least two optical fibers to the PIC and comprises an optical waveguide structure defining at least two front waveguide end faces provided at a front edge surface thereof perpendicular to its contact surface. The number of front waveguide end faces corresponds to the number of the waveguide end faces. The optical coupling device is positionable during an active positioning process to align the respective waveguide end faces. A method of manufacturing such an electro-optical assembly is also provided.

Abstract: The present document describes an optical interconnect module for interfacing optical fibers. An optical interconnect module in accordance with an embodiment comprises a casing including a projection and an optical sub-assembly including an interlock portion for receiving the projection of the casing. The optical sub-assembly carries a plurality of optical fibers, and couples face to face with an optical cable assembly for aligning the corresponding fibers together. The optical cable assembly is usually provided in an optical cable connector, along with a spring which compresses when the optical cable connector is inserted in the optical interconnect module. The pressure provided by the spring is transmitted to the optical sub-assembly. The optical sub-assembly applies this pressure to the projection received in the notch thereof for maintaining a tight engagement with the optical cable assembly.

Abstract: There is provided a mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the optical connector having an optical cable end to which is attached an optical cable and having a connector end opposite the optical cable end, the mating clip comprising: a cover for substantially covering the optical connector, the cover comprising an opening to permit passage of the optical cable; an S-shaped curved feature extending from the cover and for applying a force against the optical cable end; and a hook-shaped feature extending from the cover in the direction of the connector end of the optical connector and for securing an assembly formed by the mating clip and the optical connector to the optical port; wherein, in the securing of mating clip/optical connector assembly, the hook-shaped feature interacts with at least one of a notch internal to the hybrid optically enabled integrated circuit package; and a protrusion on the optica

Abstract: There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.