Abstract: A pulsed control vibratory particle hopper includes a particle hopper, a vibrating tray, a mechanical vibrator, and a controller. The particle hopper includes a hopper outlet, and the vibrating tray receives particles from the hopper outlet. The mechanical vibrator is mechanically connected to the vibrating tray to generate a baseline vibration, as well as a periodic vibration amplitude spike or pulse. The controller is in communication with the mechanical vibrator to control the mechanical vibrator and generate the periodic vibration amplitude spike with a duration Tp, a maximum amplitude Ap, and a frequency Fp. The pulse duration, pulse amplitude, and pulse frequency are determined based on the size or a type of the material being dispensed from the particle hopper.

Abstract: The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing material to the surface of the chemically cleaned or plasma etched metal graphite composite material, and thereby forming an intermediate layer; (d) applying a metal coating on the intermediate layer, and thereby forming a composite material. The invention also relates to a composite material comprising (a) a metal graphite composite substrate having at least one surface that is substantially free of graphite; (b) a metal-containing intermediate layer located on a surface of the substrate; and (c) a metal coating on the intermediate layer.

Abstract: The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing material to the surface of the chemically cleaned or plasma etched metal graphite composite material, and thereby forming an intermediate layer; (d) applying a metal coating on the intermediate layer, and thereby forming a composite material. The invention also relates to a composite material comprising (a) a metal graphite composite substrate having at least one surface that is substantially free of graphite; (b) a metal-containing intermediate layer located on a surface of the substrate; and (c) a metal coating on the intermediate layer.

Abstract: The invention relates to a method that involves (a) removing graphite from at least one surface of a metal graphite composite material; (b) chemically cleaning or plasma etching the surface of the metal graphite composite material; (c) applying a metal-containing material to the surface of the chemically cleaned or plasma etched metal graphite composite material, and thereby forming an intermediate layer; (d) applying a metal coating on the intermediate layer, and thereby forming a composite material. The invention also relates to a composite material comprising (a) a metal graphite composite substrate having at least one surface that is substantially free of graphite; (b) a metal-containing intermediate layer located on a surface of the substrate; and (c) a metal coating on the intermediate layer.

Abstract: A capacitor-grade wire made from powder metallurgy containing at least niobium and silicon, wherein the niobium is the highest weight percent metal present in the niobium wire. The wire having a controlled tensile strength at finish diameter exceeds the strength of capacitor-grade wire formed by ingot metallurgy. Also, the powder metallurgy wire hardness exceeds capacitor-grade wire formed from ingot metallurgy with electrical leakage meeting the specifications normally applied to capacitor grade tantalum, niobium or niobium-zirconium lead wire at sinter temperatures of about 1150° C. and above.

Abstract: A capacitor-grade wire made from powder metallurgy containing at least niobium and silicon, wherein the niobium is the highest weight percent metal present in the niobium wire. The wire having a controlled tensile strength at finish diameter exceeds the strength of capacitor-grade wire formed by ingot metallurgy. Also, the powder metallurgy wire hardness exceeds capacitor-grade wire formed from ingot metallurgy with electrical leakage meeting the specifications normally applied to capacitor grade tantalum, niobium or niobium-zirconium lead wire at sinter temperatures of about 1150° C. and above.

Abstract: The invention relates to a process for making an annealing band, the process comprising (a) producing a refractory metal powder; or refractory metal alloy powder; (b) optionally blending the powder with an oxide component or a carbide component; (c) consolidating the powder or powder blend and forming a consolidated powder component; (d) subjecting the consolidated powder component to thermo-mechanical treatment and forming a sheet, or tube; (e) cutting the sheet into a strip; and (f) forming an annealing band from the strip. Then invention also relates to annealing bands and processes for using annealing bands.

Abstract: A powder metal (P/M) mill product and the method of fabrication such product made out of low oxygen (<400 ppm) refractory metal, or alloys thereof, using oxide additive (such as MgO, SiO2, and Y2O3) for co-fabrication to achieve refractory metal grain size stabilization as required in high temperature applications. One such product is a sheet with small grain size containing oxide particles as grain size stabilizers. The product has good mechanical properties, low oxygen content in refractory metal fiber derivatives of the powder within the mill product and if is available as large pieces of sheet (lateral dimensions). The metal powder is consolidated to a sheet bar by different methods, which may weigh 50 pounds or more.

Abstract: A capacitor-grade wire made from powder metallurgy containing at least niobium and silicon, wherein the niobium is the highest weight percent metal present in the niobium wire. The wire having a controlled tensile strength at finish diameter exceeds the strength of capacitor-grade wire formed by ingot metallurgy. Also, the powder metallurgy wire hardness exceeds capacitor-grade wire formed from ingot metallurgy with electrical leakage meeting the specifications normally applied to capacitor grade tantalum, niobium or niobium-zirconium lead wire at sinter temperatures of about 1150° C. and above.