Abstract: A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

Abstract: Methods and systems for thermal management are disclosed. The thermal management method and systems may reduce the likelihood of a data processing system exceeding thermal limits even in cases of highly customizable and modifiable data processing system. To reduce the likelihood of the data processing system failing to meet thermal limits, the data processing system may implement a distributed thermal management system. The distributed thermal management system may include multiple components that are responsible for granular and/or global thermal management of the data processing system.

Abstract: Embodiments may be directed to a codesigned shroud for a chassis comprising a plurality of components and a plurality of fans generating a plurality of airflows to cool the plurality of components. The codesigned shroud may have a plurality of walls defining a plurality of channels, wherein at least two walls of the plurality of walls define each channel of the plurality of channels. Each channel may be aligned with a direction of an airflow of the plurality of airflows. At least one channel includes a set of baffles oriented substantially perpendicular to the direction of an airflow in the channel. Each baffle may be formed with acoustically absorbent material to absorb acoustic energy that could affect performance of a component, wherein a first baffle of the set of baffles is offset from a second baffle of the set of baffles.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: Embodiments may be directed to a codesigned shroud for a chassis comprising a plurality of components and a plurality of fans generating a plurality of airflows to cool the plurality of components. The codesigned shroud may have a plurality of walls defining a plurality of channels, wherein at least two walls of the plurality of walls define each channel of the plurality of channels. Each channel may be aligned with a direction of an airflow of the plurality of airflows. At least one channel includes a set of baffles oriented substantially perpendicular to the direction of an airflow in the channel. Each baffle may be formed with acoustically absorbent material to absorb acoustic energy that could affect performance of a component, wherein a first baffle of the set of baffles is offset from a second baffle of the set of baffles.

Abstract: In one or more embodiments, one or more systems may comprise a system for reducing acoustic energy in a chassis, the system comprising an acoustically absorbent material configured to fill a volume in the chassis between a set of fans and a set of components. A plurality of ducts formed in the acoustically absorbent material prevents turbulent shedding around obstacles and areas of recirculation to streamline the airflows and the acoustically absorbent material absorbs acoustic energy traveling through the ducts.

Abstract: Methods and systems for thermal management are disclosed. The thermal management method and systems may reduce the likelihood of a data processing system exceeding thermal limits even in cases of highly customizable and modifiable data processing system. To reduce the likelihood of the data processing system failing to meet thermal limits, the data processing system may implement a distributed thermal management system. The distributed thermal management system may include multiple components that are responsible for granular and/or global thermal management of the data processing system.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

Abstract: A computing device includes a printed circuit board, a base, and a heater apparatus. The printed circuit board is secured to the base. The heater apparatus includes a heater component and a plurality of heater wires, and the heater component is disposed between the printed circuit board and the base.

Abstract: An information handling system includes a baseboard management controller (BMC) and a cooling module that receives a control signal from the BMC. The cooling module includes an air mover assembly, and a foam gasket that is disposed in between the air mover assembly and the bulkhead. A cam assembly has a cam lever holder that draws in a compression bracket to provide axial stress to the air mover assembly, a bulkhead, and the foam gasket.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: An information handling system includes a baseboard management controller (BMC) and a cooling module that receives a control signal from the BMC. The cooling module includes an air mover assembly, and a foam gasket that is disposed in between the air mover assembly and the bulkhead. A cam assembly has a cam lever holder that draws in a compression bracket to provide axial stress to the air mover assembly, a bulkhead, and the foam gasket.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: An information handling system may include a processor, a memory, modules including one or more information handling resources and having a corresponding airflow impedance associated therewith, and a cooling system that includes a controller and of air movers. The controller may be configured to, in response to a determination that a first module of the plurality of modules has a first airflow impedance higher than an upper threshold impedance and that a second module of the plurality of modules has a second airflow impedance lower than a lower threshold impedance: determine a scaling factor based on the first and second airflow impedances, scaling factor being usable by the controller to adjust an amount of airflow provided by the plurality of air movers; and control the plurality of air movers in an open-loop fashion according to the scaling factor.

Abstract: An information handling system may include a processor, a memory, modules including one or more information handling resources and having a corresponding airflow impedance associated therewith, and a cooling system that includes a controller and of air movers. The controller may be configured to, in response to a determination that a first module of the plurality of modules has a first airflow impedance higher than an upper threshold impedance and that a second module of the plurality of modules has a second airflow impedance lower than a lower threshold impedance: determine a scaling factor based on the first and second airflow impedances, scaling factor being usable by the controller to adjust an amount of airflow provided by the plurality of air movers; and control the plurality of air movers in an open-loop fashion according to the scaling factor.