Patents by Inventor Richard Mellitz

Richard Mellitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230335960
    Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
    Type: Application
    Filed: February 4, 2021
    Publication date: October 19, 2023
    Applicant: SAMTEC, INC.
    Inventors: Brandon Thomas GORE, Richard MELLITZ, Gauss YANG, Kelly GARRISON, Norman S. MCMORROW
  • Patent number: 9906267
    Abstract: One embodiment provides a network device that includes PHY circuitry comprising transmit circuitry (Tx) and receive circuitry (Rx), wherein the Tx and Rx circuitry are configured to be coupled to a respective channel to communicate with an external device via the channels, wherein the network device configured to communicate with the external device using an Ethernet communications protocol; and test circuitry.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: February 27, 2018
    Assignee: INTEL CORPORATION
    Inventors: Richard Mellitz, Adee O. Ran
  • Publication number: 20160182124
    Abstract: One embodiment provides a network device that includes PHY circuitry comprising transmit circuitry (Tx) and receive circuitry (Rx), wherein the Tx and Rx circuitry are configured to be coupled to a respective channel to communicate with an external device via the channels, wherein the network device configured to communicate with the external device using an Ethernet communications protocol; and test circuitry.
    Type: Application
    Filed: October 19, 2015
    Publication date: June 23, 2016
    Applicant: INTEL CORPORATION
    Inventors: RICHARD MELLITZ, ADEE O. RAN
  • Patent number: 9197288
    Abstract: One embodiment provides a network device that includes PHY circuitry comprising transmit circuitry (Tx) and receive circuitry (Rx), wherein the Tx and Rx circuitry are configured to be coupled to a respective channel to communicate with an external device via the channels, wherein the network device configured to communicate with the external device using an Ethernet communications protocol; and test circuitry.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: November 24, 2015
    Assignee: Intel Corporation
    Inventors: Richard Mellitz, Adee Ran
  • Publication number: 20140072023
    Abstract: One embodiment provides a network device that includes PHY circuitry comprising transmit circuitry (Tx) and receive circuitry (Rx), wherein the Tx and Rx circuitry are configured to be coupled to a respective channel to communicate with an external device via the channels, wherein the network device configured to communicate with the external device using an Ethernet communications protocol; and test circuitry.
    Type: Application
    Filed: March 8, 2013
    Publication date: March 13, 2014
    Inventors: Richard Mellitz, Adee Ran
  • Patent number: 8661313
    Abstract: Techniques are described that can extend the transmission rate over cable. Multiple cables can be used to increase the transmission rate. The transmission standard applied for each cable can be an Ethernet backplane standard such as IEEE 802.3ap (2007). Data can be assigned to virtual lanes prior to transmission over a cable. Forward error correction may be applied to each virtual lane prior to transmission over cable. Forward error correction may be negotiated over a single virtual lane and then applied to all virtual lanes.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: February 25, 2014
    Assignee: Intel Corporation
    Inventors: Ilango Ganga, Richard Mellitz
  • Patent number: 8645804
    Abstract: Techniques are described that can be used to extend the data transmission rate specified by 10GBASE-KR of IEEE 802.3ap (2007) to more than 10 Gb/s using a multiple lane backplane. A signal for transmission over 10 Gb/s can be divided into multiple streams for transmission over multiple lanes. Multiple transceiver pairs can be used for transmission and receipt of the multiple streams. Each transceiver pair may comply with 10GBASE-KR of IEEE 802.3ap (2007).
    Type: Grant
    Filed: October 8, 2012
    Date of Patent: February 4, 2014
    Assignee: Intel Corporation
    Inventors: Ilango Ganga, Richard Mellitz
  • Publication number: 20130117639
    Abstract: Techniques are described that can extend the transmission rate over cable. Multiple cables can be used to increase the transmission rate. The transmission standard applied for each cable can be an Ethernet backplane standard such as IEEE 802.3ap (2007). Data can be assigned to virtual lanes prior to transmission over a cable. Forward error correction may be applied to each virtual lane prior to transmission over cable. Forward error correction may be negotiated over a single virtual lane and then applied to all virtual lanes.
    Type: Application
    Filed: December 28, 2012
    Publication date: May 9, 2013
    Inventors: Ilango Ganga, Richard Mellitz
  • Publication number: 20130031445
    Abstract: Techniques are described that can be used to extend the data transmission rate specified by 10GBASE-KR of IEEE 802.3ap (2007) to more than 10 Gb/s using a multiple lane backplane. A signal for transmission over 10 Gb/s can be divided into multiple streams for transmission over multiple lanes. Multiple transceiver pairs can be used for transmission and receipt of the multiple streams. Each transceiver pair may comply with 10GBASE-KR of IEEE 802.3ap (2007).
    Type: Application
    Filed: October 8, 2012
    Publication date: January 31, 2013
    Inventors: Ilango Ganga, Richard Mellitz
  • Patent number: 8307265
    Abstract: Techniques are described that can be used to extend the data transmission rate specified by 10GBASE-KR of IEEE 802.3ap (2007) to more than 10 Gb/s using a multiple lane backplane. A signal for transmission over 10 Gb/s can be divided into multiple streams for transmission over multiple lanes. Multiple transceiver pairs can be used for transmission and receipt of the multiple streams. Each transceiver pair may comply with 10GBASE-KR of IEEE 802.3ap (2007).
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: November 6, 2012
    Assignee: Intel Corporation
    Inventors: Ilango Ganga, Richard Mellitz
  • Patent number: 8018992
    Abstract: In one embodiment, the present invention includes a method communicating control information for an external adaptive equalization process for a channel coupled between a transmitter and a receiver from an external agent. In this way, the external agent may control tap settings of an equalizer based on feedback information from the receiver responsive to a data pattern generated and transmitted by the transmitter. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: September 13, 2011
    Assignee: Intel Corporation
    Inventors: Richard Mellitz, Bill Samaras, Pete MacWilliams
  • Publication number: 20100229071
    Abstract: Techniques are described that can be used to extend the data transmission rate specified by 10 GBASE-KR of IEEE 802.3ap (2007) to more than 10 Gb/s using a multiple lane backplane. A signal for transmission over 10 Gb/s can be divided into multiple streams for transmission over multiple lanes. Multiple transceiver pairs can be used for transmission and receipt of the multiple streams. Each transceiver pair may comply with 10 GBASE-KR of IEEE 802.3ap (2007).
    Type: Application
    Filed: March 9, 2009
    Publication date: September 9, 2010
    Inventors: Ilango Ganga, Richard Mellitz
  • Publication number: 20090159326
    Abstract: Embodiments of the invention include a Printed Wiring Board (PWB) having a first via connected to a top-side signal source, a second via connected to a bottom-side signal destination, and a third via connected to the first via on a lower signal layer of the PWB and further connected to the second via on an upper signal layer of the PWB. In embodiments of the invention, the third via is referred to as an S-Turn via. The S-Turn PWB routing configuration advantageously reduces reflections causes by via stubs at Multi-Giga Hertz (MGH) frequencies. Other embodiments are described.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 25, 2009
    Inventor: Richard Mellitz
  • Publication number: 20090110043
    Abstract: In one embodiment, the present invention includes a method communicating control information for an external adaptive equalization process for a channel coupled between a transmitter and a receiver from an external agent. In this way, the external agent may control tap settings of an equalizer based on feedback information from the receiver responsive to a data pattern generated and transmitted by the transmitter. Other embodiments are described and claimed.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Richard Mellitz, Bill Samaras, Peter MacWilliams
  • Patent number: 7459985
    Abstract: In some embodiments, an circuit card includes an electronic circuit substrate, a ground plane on the electronic circuit substrate, first and second differential signal pads on the electronic circuit substrate, a ground return signal pad associated with the first and second differential signal pads, the ground return signal pad being connected to the ground plane on the electronic substrate, and a cutout structure on the ground plane positioned near a location where the ground return signal pad connects to the ground plane, wherein the cutout structure is configured to direct a ground return path associated with the first and second differential signal pads to the ground return signal pad associated with the first and second differential signal pads. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: December 2, 2008
    Assignee: Intel Corporation
    Inventors: Richard Mellitz, John J. Abbott, Gopal R. Mundada
  • Publication number: 20080159371
    Abstract: In some embodiments common mode equalization is performed on a received differential signal to produce a voltage signal that is proportional to a common mode voltage of the differential signal. A command signal is provided in response to the common mode equalization to adjust a delay between two pairs of the differential signal. Other embodiments are described and claimed.
    Type: Application
    Filed: December 27, 2006
    Publication date: July 3, 2008
    Inventor: Richard Mellitz
  • Publication number: 20070152768
    Abstract: In some embodiments, an circuit card includes an electronic circuit substrate, a ground plane on the electronic circuit substrate, first and second differential signal pads on the electronic circuit substrate, a ground return signal pad associated with the first and second differential signal pads, the ground return signal pad being connected to the ground plane on the electronic substrate, and a cutout structure on the ground plane positioned near a location where the ground return signal pad connects to the ground plane, wherein the cutout structure is configured to direct a ground return path associated with the first and second differential signal pads to the ground return signal pad associated with the first and second differential signal pads. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Richard Mellitz, John Abbott, Gopal Mundada
  • Publication number: 20060234637
    Abstract: A serial communications link includes a plurality of projections disposed on a reference channel. The projections may be disposed at predetermined angles relative to a signal propagation axis of the reference channel, and may be spaced to tune the reference channel to a predetermined jitter profile based on a data rate through the channel.
    Type: Application
    Filed: April 19, 2005
    Publication date: October 19, 2006
    Inventor: Richard Mellitz
  • Publication number: 20050071112
    Abstract: A reference channel is coupled to a device under test and measurements are made at the output of the reference channel.
    Type: Application
    Filed: September 29, 2003
    Publication date: March 31, 2005
    Inventors: Jeff Morriss, Richard Mellitz