Patents by Inventor Richard Munro
Richard Munro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230278235Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: ApplicationFiled: March 6, 2023Publication date: September 7, 2023Applicant: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Publication number: 20230191627Abstract: An apparatus, system and method for providing a variable swath end effector. The variable swath end effector may include: two arms, each for retaining a portion of a retained element; two pairs of bearing rails, each pair being uniquely mechanically associated with a one of the two arms, wherein a level of one pair of bearing rails is staggered from a second level of the other pair of earing rails in a perpendicular axis, and wherein the staggered pairs of bearing rails are interleaved with each other; and a motor capable of driving a belt in mechanical association with each of the two arms, wherein actuation of the motor drives the belt to synchronously move each of the two arms across a respective one of the pairs of bearing rails to vary the swath between the two arms.Type: ApplicationFiled: May 19, 2021Publication date: June 22, 2023Applicant: JABIL INC.Inventors: JEROEN BOSBOOM, GUNNAR HAUGEN, BETHANY WEBER, RICHARD MUNRO, MICHAEL MCKENNEY, KWOK KUEN YU, BABAK NADERI
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Patent number: 11602859Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: GrantFiled: July 13, 2021Date of Patent: March 14, 2023Assignee: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Publication number: 20220143843Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: ApplicationFiled: July 13, 2021Publication date: May 12, 2022Applicant: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Patent number: 11059183Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: GrantFiled: March 2, 2020Date of Patent: July 13, 2021Assignee: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Patent number: 11027437Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.Type: GrantFiled: December 24, 2019Date of Patent: June 8, 2021Assignee: JABIL INC.Inventors: Jeroen Bosboom, Richard Munro, Tatiana Pankova Major
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Publication number: 20200306990Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: ApplicationFiled: March 2, 2020Publication date: October 1, 2020Applicant: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Publication number: 20200206954Abstract: The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.Type: ApplicationFiled: December 24, 2019Publication date: July 2, 2020Applicant: JABIL INC.Inventors: Jeroen BOSBOOM, Richard Munro, Tatiana Pankova Major
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Patent number: 10576639Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: GrantFiled: February 6, 2018Date of Patent: March 3, 2020Assignee: JABIL INC.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Patent number: 10518422Abstract: An apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.Type: GrantFiled: April 27, 2018Date of Patent: December 31, 2019Assignee: JABIL INC.Inventors: Jeroen Bosboom, Richard Munro, Tatiana Pankova Major
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Publication number: 20180311832Abstract: The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.Type: ApplicationFiled: April 27, 2018Publication date: November 1, 2018Applicant: Jabil Inc.Inventors: Jeroen BOSBOOM, Richard Munro, Tatiana Pankova Major
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Publication number: 20180161989Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: ApplicationFiled: February 6, 2018Publication date: June 14, 2018Applicant: Jabil Inc.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Patent number: 9975255Abstract: The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.Type: GrantFiled: December 15, 2016Date of Patent: May 22, 2018Assignee: Jabil Inc.Inventors: Jeroen Bosboom, Richard Munro, Tatiana Pankova Major
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Patent number: 9919430Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.Type: GrantFiled: December 6, 2016Date of Patent: March 20, 2018Assignee: Jabil Inc.Inventors: Jeroen Bosboom, Babak Naderi, Richard Munro, Tatiana Pankova Major
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Publication number: 20150336481Abstract: The present invention resides in a child restraint system for a vehicle. The child restraint system comprises a base unit (10) that is configured to be secured to a vehicle seat (5). A seat (30) is also provided. The seat (30) has a seat shell (32) into which a child is to be received and a base (34) upon which the seat shell (32) is supported. The base unit (10) has a receiving portion configured to removably receive the seat (30), the seat (30) being any one of a rearward or forward facing child seat, or any combination of a rearward and forward facing seat. Wherein, the base unit (10) has a substantially upright portion which has connected thereto a first tether (17) attachable to an anchorage point (4) on the vehicle.Type: ApplicationFiled: December 29, 2012Publication date: November 26, 2015Inventor: Richard Munro HORSFALL
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Patent number: 8774631Abstract: A non-blocking telecommunications node comprising a plurality of ports. Each port adapted to pass telecommunications traffic comprising multiplexed signals. Each port is adapted to receive an incoming multiplexed signal comprising a plurality of component signals each having a predetermined wavelength. The node includes a plurality of transponders each arranged to receive a component signal. The plurality of transponders are arranged and connected to the ports such that each instance of a component signal having a specific wavelength received by each of the ports can be received simultaneously by the transponders. A node for adding component signals to an outgoing multiplexed signal is also disclosed.Type: GrantFiled: August 20, 2008Date of Patent: July 8, 2014Assignee: Telefonaktiebolaget L M Ericsson (publ)Inventor: Richard Munro Dorward
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Patent number: 8216239Abstract: A bone fixation device includes an intramedullary pin having a longitudinal axis, a proximal end, and a distal tip configured and dimensioned for insertion into a medullary canal of a bone and a bone plate disposed at the proximal end of the intramedullary pin, wherein the bone plate includes an angled tab configured and dimensioned to have a center of gravity lying on a radius of a cross-sectional area of the intramedullary pin taken orthogonally to the intramedullary pin's longitudinal axis.Type: GrantFiled: November 6, 2009Date of Patent: July 10, 2012Assignee: Synthes USA, LLCInventors: Chad Richard Munro, Peter Senn
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Publication number: 20110182302Abstract: A non-blocking telecommunications node comprising a plurality of ports. Each port adapted to pass telecommunications traffic comprising multiplexed signals. Each port is adapted to receive an incoming multiplexed signal comprising a plurality of component signals each having a predetermined wavelength. The node includes a plurality of transponders each arranged to receive a component signal. The plurality of transponders are arranged and connected to the ports such that each instance of a component signal having a specific wavelength received by each of the ports can be received simultaneously by the transponders. A node for adding component signals to an outgoing multiplexed signal is also disclosed.Type: ApplicationFiled: August 20, 2008Publication date: July 28, 2011Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)Inventor: Richard Munro Dorward
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Publication number: 20100063504Abstract: The invention relates to a device for bone fixation, comprising A) an intramedullary pin (1) having a longitudinal axis (17), a distal tip (2) for introduction into the marrow cavity, and a proximal rear end (3) and B) a bone plate (10), for location on the greater trochanter, arranged at the proximal rear end (3) of the pin (1), whereby C) the pin (1) has a through transverse drilling (6) in the proximal half (7) thereof which faces the proximal rear end (3), for housing a hip screw (30) and D) the bone plate (10) terminates proximally above the transverse drilling (6).Type: ApplicationFiled: November 6, 2009Publication date: March 11, 2010Inventors: Chad Richard Munro, Peter Senn
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Patent number: 7632272Abstract: A device for bone fixation includes an intramedullary pin and a bone plate. The intramedullary pin has a longitudinal axis with a distal tip configured for insertion into the medullary canal. The intramedullary pin also has at least one transverse borehole passing through it for accommodating a hip screw. The bone plate is disposed at the proximal rear end of the intramedullary pin and lies in contact with the greater trochanter.Type: GrantFiled: October 3, 2002Date of Patent: December 15, 2009Assignee: Synthes USA, LLCInventors: Chad Richard Munro, Peter Senn