Abstract: An LGA interconnect device, method of making, and device for making.

Abstract: A fully buffered memory module is disclosed having a two piece housing comprised of a primary housing portion and an alignment plate. An array of terminals is included having at least two terminal configurations where the terminals are trapped between the primary housing portion and the alignment plate. A printed circuit board tine of the electrical terminals extend through the alignment plate while a contact portion protrudes into a slot which receives the memory module.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. A grounding clip surrounds the housing and is conductively connected to the substrate, and has spring arms which are connectable to heat sink hardware on one side thereof and to a printed circuit board on the other side.

Abstract: A socket is shown having an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. The substrates are located relative to a mating device by way of pins attached to the substrate. The pins are locked to the substrate by way of a locking device, whereby the pins are rotated and locked in place.

Abstract: A socket which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate. Pins are securely located on the substrate, which are used to align the interconnect with the electrical component for connection.

Abstract: A socket is provided for an electronic package. The socket includes a cover and base that are slidably joined with one another. An actuator drives the cover and base between open and closed positions or states as the actuator is rotated through a range of motion between open and closed positions, respectively. The socket further includes a socket state indicator provided on the base and located proximate one of the actuator and the cover. The socket state indicator is positioned, such that a relative spacing between the socket state indicator and one of the actuator and cover indicates when the cover and base are in the open state. The socket state indicator may include a ramped detent provided within the actuator's range of motion. Alternatively, the socket state indicator may include posts formed on the base. The cover moves relative to the posts as the state of the socket changes.

Abstract: A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.

Abstract: A socket for an electronic package includes a cover and a base slidably joined with one another. A cam assembly drives the cover relative to the base between open and closed positions, and a bias element directly contacts the cam assembly to force the cam assembly to a fully open position when the cam assembly is moved from the closed position. The cam assembly is adapted for linear displacement relative to the base when actuated, and the bias element exerts a force on the cam assembly to locate the cover in the open position. The bias element is located between the cover and the base.

Abstract: A socket is provided for an electronic package. The socket includes a cover and base that are slidably joined with one another. An actuator drives the cover and base between open and closed positions or states as the actuator is rotated through a range of motion between open and closed positions, respectively. The socket further includes a socket state indicator provided on the base and located proximate one of the actuator and the cover. The socket state indicator is positioned, such that a relative spacing between the socket state indicator and one of the actuator and cover indicates when the cover and base are in the open state. The socket state indicator may include a ramped detent provided within the actuator's range of motion. Alternatively, the socket state indicator may include posts formed on the base. The cover moves relative to the posts as the state of the socket changes.

Abstract: An electrical socket assembly having a socket cover slidably mounted to a socket base over a range of motion. The socket assembly also includes a drive plate mounted to a cam portion of the socket cover. The drive plate and socket cover have range limit elements that engage one another to limit opposite ends of the range of motion. The socket assembly includes a cam shaft that engages the socket cover, drive plate, and socket base. The cam shaft is rotatable across a range of motion between an unlocked position and a locked position to slide the socket cover with respect to the socket base.

Abstract: A socket is provided for receiving electronic packages having different first and second sizes. The socket comprises a base housing having a top surface including an array of pin receiving chambers as well as base side walls. The socket also comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers. The cover also includes cover side walls that slidably engage the base side walls. Further, the socket comprises first and second locating members provided on at least one of the base housing and cover. The first locating member is positioned to engage and align an electronic package having a first size with the array of holes in the cover, and the second locating member is positioned to engage and align an electronic package of a second size with the array of holes in the cover.

Abstract: A shielded, stacked electrical connector assembly comprises an upper electrical connector (2) and a lower electrical connector (4) having respective insulating housings (6,8). Each housing (6,8) has cavities (18) in which are secured electrical terminals (20) having terminal legs (46 and 50) which extend from a terminal receiving face (24) of the housing (6 or 8). A one piece, insulating, connector support housing (10) comprises an upright frame (54) from which projects a connector support (86) supporting the upper connector (2), the lower connector (4) being disposed beneath the connector support (86). The terminal legs (46) of the upper connector (2) extend through notches (80,82) in terminal leg spacer plates in the frame (54). The terminal legs (50) of the terminals (20) of the lower connector (4) extend through notches (44) in a terminal leg spacer plate (42) of the housing (8) of the lower connector (4).