Abstract: Placement elements are removed from a placement element carrier by a vacuum pipette that is positioned above a placement element and is connected to a vacuum source. An air flow formed at the vacuum pipette causes a force to be exerted on the placement element, which causes the placement element to move toward the vacuum pipette. Consequently, the placement element can be removed from the placement element carrier without jolting.

Abstract: An mounting apparatus for mounting an electrical component onto a substrate of an electrical assembly. The mounting apparatus employs a compensating element to facilitate the component mounting operation. The compensating element includes a spring member and a damping member. The spring member applies an optimal contact pressure for securely mounting said component without damaging the component. The damping element acts to damp the spring member during so as to effectively reduce a spring force that acts on the mounting apparatus during the component delivery stage.