Abstract: A package for interconnecting a plurality of integrated circuit chips into a functional unit comprising a multilayer substrate having ground and power conducting layers and a frame for holding the chips with their terminal pads on the side of the frame opposite the substrate. Power and ground terminal pads on the chips are coupled to the appropriate potentials via registering conductive feedthroughs passing through the frame and into the substrate into contact with appropriate power or conductive layers in the substrate. Signal pads on the chips are interconnected by means of a conductive layer which is located over the chips on the side of the frame opposite the substrate.

Abstract: A method of providing a unitary body comprised of two initially separate layers having similar coefficients of thermal expansion involves forming a mat of glass fibers in a configuration suitable for bonding the two layers together, placing the glass mat between them and heating the resulting stack to a temperature at which the individual fibers of the glass mat deform to form a continuous layer of glass which adheres to both layers, after which the stack is cooled to result in the unitary body.

Abstract: Solder layers in a semiconductor chip package, which electrically interconnect conductors used to gain electrical access to the electrodes on the semiconductor chip, are subjected to a transverse compressive force in excess of about 2 pounds per square inch. The semiconductor chip package can thereby undergo a marked increase in the number of cycles of heating and cooling before it fails due to increased thermal resistance arising from structural degradation of the solder layers.

Abstract: A silicon circuit board incorporates multiple levels of patterned conductors. First level upper and lower patterned conductors are situated on an insulation-coated, monocrystalline silicon substrate. Upper and lower, high resistivity, polycrystalline silicon layers, in turn, are situated on the first level upper and lower patterned conductors, respectively. Second level upper and lower patterned conductors are situated over the upper and lower polycrystalline silicon layers. Further levels of patterned conductors in the circuit board may be provided by iteratively forming on the board polycrystalline silicon layers and patterned conductors. Conducting feedthroughs in the circuit board provide electrical communication between various patterened conductors.

Abstract: A thermistor suitable for use in a temperature range with a maximum temperature exceeding 400.degree. C. comprises bulk thermistor material with a pair of electrical leads attached to the thermistor material by respective quantities of conductive paste each having a curing temperature substantially in excess of the aforementioned maximum temperature.

Abstract: Contaminant metal residue on an organic passivation layer of a semiconductor device is removed by plasma etching thereof whereby the performance of the device is restored.

Abstract: A humidity sensitive device is formed of a humidity sensitive material comprised of a magnesium aluminate spinel and titania material. The humidity sensitive device includes various means for applying heat to the humidity sensitive material to purge the humidity sensitive material of foreign substances and also thereby to restore or rejuvenate the characteristics of the humidity sensitive material.

Abstract: A threaded lid for closing the opening in a pump housing having a body portion and a gripping formation defined by a ridge on the body portion having a central portion and projections extending beyond the central portion. A juncture between the central portion and each of the projections varies gradually from a rounded angle at one terminus of the juncture to a gently sloping ramp at the other terminus of the juncture, so that a simple elongated tool such as a stick may be placed between the projections of the gripping formation and rotated to loosen the lid, but not to tighten it. Furthermore, the mildly curved S-shape provides surfaces which conform to the hand to enable substantial manual loosening force to be applied comfortably to the lid, whereas the surfaces of the gripping formation engaged by the hand to tighten the lid are not conducive to the application of a substantial amount of manual force.