Abstract: A flight data recorder having a crash survivable memory unit, a processing unit, a data transmit device and a support device for supporting the data transmit device. The support device includes an electromagnetic interference reduction device that surrounds the data transmit device. The support device is coupled to the crash survivable memory unit or the processing unit for supporting the electromagnetic interference reduction device.

Abstract: A high strength, light weight crash survivable memory unit (CSMU). The CSMU includes memory storage devices surrounded by a heat resistive material. A housing surrounds the heat resistive material. The housing includes a plurality of panels that include Titanium. Two or more of the panels are fusion welded together. The welding is performed at tapered outer edges of one or more of the panels.

Abstract: A flight data recorder having a crash survivable memory unit, a processing unit, a data transmit device and a support device for supporting the data transmit device. The support device includes an electromagnetic interference reduction device that surrounds the data transmit device. The support device is coupled to the crash survivable memory unit or the processing unit for supporting the electromagnetic interference reduction device.

Abstract: A high strength, light weight crash survivable memory unit (CSMU). The CSMU includes memory storage devices surrounded by a heat resistive material. A housing surrounds the heat resistive material. The housing includes a plurality of panels that include Titanium. Two or more of the panels are fusion welded together. The welding is performed at tapered outer edges of one or more of the panels.

Abstract: A printed circuit board chassis device for securely holding printed circuit boards (PCB) while allowing for easy insertion and extraction. The device includes circuit board securing devices. The securing devices include a base section and a securing member. The base section is attached to a structural component of the chassis device. The base section includes a groove formed by a first and second wall. A first component moves the securing element at a first end longitudinally within the groove of the base section. A second component keeps a second end of the securing element within the groove of the base section. Force-producing devices move the securing element closer to the first wall of the base section as the first component is adjusted.

Abstract: A printed circuit board chassis device for securely holding printed circuit boards (PCB) while allowing for easy insertion and extraction. The device includes circuit board securing devices. The securing devices include a base section and a securing member. The base section is attached to a structural component of the chassis device. The base section includes a groove formed by a first and second wall. A first component moves the securing element at a first end longitudinally within the groove of the base section. A second component keeps a second end of the securing element within the groove of the base section. Force-producing devices move the securing element closer to the first wall of the base section as the first component is adjusted.

Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.

Abstract: An adapter for a surface mount device, the adapter including an insulating body having offset first and second surfaces; a pattern of surface mount solder pads formed on the first surface; a pattern of signal carriers communicating between the first and second surfaces, each of the signal carriers being at least partially exposed in an area between the first and second surfaces and adjacent to the second surface; and a plurality of signal lines electrically coupling one or more of the surface mount solder pads with predetermined ones of the signal carriers.

Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.

Abstract: An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.

Abstract: A device and method to provide backup electrical power to a vehicle data acquisition and recording system. The device operates to control its charging state, discharge state, and interval of discharge to ensure reliable operation of the recording system. The method delineates the process by which continuous electrical power can be supplied to the recording system.

Abstract: An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.

Abstract: An adapter for a surface mount device, the adapter including an insulating body having offset first and second surfaces; a pattern of surface mount solder pads formed on the first surface; a pattern of signal carriers communicating between the first and second surfaces, each of the signal carriers being at least partially exposed in an area between the first and second surfaces and adjacent to the second surface; and a plurality of signal lines electrically coupling one or more of the surface mount solder pads with predetermined ones of the signal carriers.

Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.

Abstract: A crash-survivable enclosure (10) for protecting a data memory unit (45) used in vehicles has a shell (15) with an inner surface (22). The shell (15) defines an interior cavity (26) which contains the data memory unit (45). The enclosure (10) has a heat absorption composition (20) which lines a portion of the inner surface (22) and substantially surrounds the data memory unit (45). The composition is capable of exhibiting an endothermic phase transition when subjected to a high temperature environment. The phase transition is typically from a solid phase to a non-solid, flowable phase. The shell can also have a plurality of vents (42). The vents (42) are sized and positioned to permit the heat absorption material (20) to drain from the shell when in the non-solid, flowable phase. The vents (42) can be positioned such that the flowable heat absorption material will drain regardless of the orientation of the shell (15).

Abstract: The present invention provides methods and compositions useful for heat absorption and dissipation, which include between about 10 percent and about 99 percent by weight of a bicarbonate compound and between about 90 percent and about 1 percent by weight of binder, and thermally protected enclosures including the same.

Abstract: Methods for heat absorption and heat dissipation, by enclosing a heat sensitive device with between about 10 percent and about 99 percent by weight of a bicarbonate compound. The bicarbonate compound is optionally combined with between about 90 percent and about 1 percent by weight of binder.