Patents by Inventor Richard Omar Collins

Richard Omar Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR THE DEPOSITION OF HIGH DIELECTRIC CONSTANT FILMS
    Publication number: 20130333621
    Abstract: An integrated deposition system is described that is capable of vaporizing low vapor pressure liquid precursors and conveying the vapor to a processing region to fabricate advanced integrated circuits. The integrated deposition system includes a heated exhaust system, a remote plasma generator, a processing chamber, a liquid delivery system, and a computer control module that together create a commercially viable and production worthy system for depositing high capacity dielectric materials from low vapor pressure precursors.
    Type: Application
    Filed: May 31, 2013
    Publication date: December 19, 2013
    Inventors: Bobby M. RONSSE, Craig R. METZNER, Richard Omar COLLINS
  • Apparatus for the deposition of high dielectric constant films
    Patent number: 8496780
    Abstract: An integrated deposition system is described that is capable of vaporizing low vapor pressure liquid precursors and conveying the vapor to a processing region to fabricate advanced integrated circuits. The integrated deposition system includes a heated exhaust system, a remote plasma generator, a processing chamber, a liquid delivery system, and a computer control module that together create a commercially viable and production worthy system for depositing high capacity dielectric materials from low vapor pressure precursors.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: July 30, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Bobby M. Ronsse, Craig R. Metzner, Richard Omar Collins
  • Apparatus for the deposition of high dielectric constant films
    Publication number: 20030101938
    Abstract: An integrated deposition system is described that is capable of vaporizing low vapor pressure liquid precursors and conveying the vapor to a processing region to fabricate advanced integrated circuits. The integrated deposition system includes a heated exhaust system, a remote plasma generator, a processing chamber, a liquid delivery system, and a computer control module that together create a commercially viable and production worthy system for depositing high capacity dielectric materials from low vapor pressure precursors.
    Type: Application
    Filed: September 20, 2002
    Publication date: June 5, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Bobby M. Ronsse, Craig R. Metzner, Richard Omar Collins