Abstract: A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product as well as process and an apparatus for producing the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: Embodiments of thermally and chemically strengthened glass-based articles are disclosed. In one or more embodiments, the glass-based articles may include a first surface and a second surface opposing the first surface defining a thickness (t), a first CS region comprising a concentration of a metal oxide that is both non-zero and varies along a portion of the thickness, and a second CS region being substantially free of the metal oxide of the first CS region, the second CS region extending from the first surface to a depth of compression of about 0.17·t or greater. In one or more embodiments, the first surface is flat to 100 ?m total indicator run-out (TIR) along any 50 mm or less profile of the first surface. Methods of strengthening glass sheets are also disclosed, along with consumer electronic products, laminates and vehicles including the same are also disclosed.

Abstract: Embodiments of thermally and chemically strengthened glass-based articles are disclosed. In one or more embodiments, the glass-based articles may include a first surface and a second surface opposing the first surface defining a thickness (t), a first CS region comprising a concentration of a metal oxide that is both non-zero and varies along a portion of the thickness, and a second CS region being substantially free of the metal oxide of the first CS region, the second CS region extending from the first surface to a depth of compression of about 0.17·t or greater. In one or more embodiments, the first surface is flat to 100 ?m total indicator run-out (TIR) along any 50 mm or less profile of the first surface. Methods of strengthening glass sheets are also disclosed, along with consumer electronic products, laminates and vehicles including the same are also disclosed.

Abstract: A strengthened glass sheet product as well as process and an apparatus for making the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product as well as process and an apparatus for making the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product as well as process and an apparatus for making the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product as well as process and an apparatus for producing the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: Equipment and manufacturing processes allow for strengthened glass or glass ceramic articles having unique stress profiles, such as high negative tensile stresses and steep tensile stress curves with respect to depth, in strengthened glass or glass ceramic articles that are thin and/or have large-area structures for a given degree of thermal temping.

Abstract: A strengthened glass sheet product as well as process and an apparatus for making the product. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: A strengthened glass sheet product along with a process and an apparatus for strengthening a glass sheet are provided. The process comprises cooling the glass sheet by non-contact thermal conduction for sufficiently long to fix a surface compression and central tension of the sheet. The process results in thermally strengthened glass sheets having improved breakage properties.

Abstract: Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y- axial directions.

Abstract: Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y- axial directions.

Abstract: Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y-axial directions.

Abstract: Methods and apparatus for producing a semiconductor structure include: subjecting an implantation surface of a semiconductor wafer to an ion implantation process to create an exfoliation layer therein, wherein the ion implantation process includes simultaneously implanting two different species of ions into the implantation surface of the semiconductor wafer.

Abstract: Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y-axial directions.

Abstract: Disclosed are methods for making SOI and SOG structures using purified ion shower for implanting ions to the donor substrate. The purified ion shower provides expedient, efficient, low-cost and effective ion implantation while minimizing damage to the exfoliation film.